| Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim Chemical Engineering Journal 299, 37-44, 2016 | 180 | 2016 |
| Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO YS Ham, S Choe, MJ Kim, T Lim, SK Kim, JJ Kim Applied Catalysis B: Environmental 208, 35-43, 2017 | 161 | 2017 |
| Proton-exchange membrane CO2 electrolyzer for CO production using Ag catalyst directly electrodeposited onto gas diffusion layer YS Ham, YS Park, A Jo, JH Jang, SK Kim, JJ Kim Journal of Power Sources 437, 226898, 2019 | 30 | 2019 |
| Direct formation of dendritic Ag catalyst on a gas diffusion layer for electrochemical CO2 reduction to CO and H2 YS Ham, MJ Kim, T Lim, DK Kim, SK Kim, JJ Kim International Journal of Hydrogen Energy 43 (24), 11315-11325, 2018 | 25 | 2018 |
| Fabrication of Au catalysts for electrochemical reduction of CO2 to syngas YS Ham, MJ Kim, J Choi, S Choe, T Lim, SK Kim, JJ Kim Journal of Nanoscience and Nanotechnology 16 (10), 10846-10852, 2016 | 10 | 2016 |
| Cyclic voltammetry stripping analysis to determine iodide ion concentration in Cu plating bath Y Yoon, YS Ham, TY Kim, S Choe, JJ Kim Journal of The Electrochemical Society 165 (5), H213, 2018 | 8 | 2018 |
| Communication—Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath S Choe, MJ Kim, T Lim, YS Ham, SK Kim, JJ Kim Journal of The Electrochemical Society 163 (14), D747, 2016 | 7 | 2016 |
| Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition J Kang, CM Kim, DY Yu, YS Ham, SK Cho, JJ Kim Transactions of the IMF 97 (1), 22-27, 2019 | 5 | 2019 |
| Cu seed layer damage caused by insoluble anode in Cu electrodeposition YS Ham, SK Cho, JJ Kim Korean Journal of Chemical Engineering 34, 1490-1494, 2017 | 3 | 2017 |
| Electrodeposition of Ag Catalysts for Electrochemical CO2 Reduction YS Ham, MJ Kim, T Lim, SK Kim, JJ Kim Electrochemical Society Meeting Abstracts 233, 1627-1627, 2018 | | 2018 |
