| Realization of Circuits with Additively Printed Water Based Nanoparticle Sustainable Silver-Ink with Ultrasonic Atomization on Aerosol Jet Printer P Lall, D Karakitie, V Soni, S Miller 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 19 | 2023 |
| Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink P Lall, D Karakitie, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 8 | 2023 |
| Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer P Lall, D Karakitie, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 8 | 2023 |
| Construction of a pilot scale biogas digester at the University of Ibadan Dairy Farm, Abadina CE Aralu, DE Karakitie, DA Fadare Fuel Communications 9, 100033, 2021 | 8 | 2021 |
| Performance charateristics of a conventional spark ignition petrol engine powered by biogas ED Karakitie, CE Aralu, AD Fadare Fuel Communications 10, 100032, 2022 | 6 | 2022 |
| Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits P Lall, V Soni, S Bimali, D Karakitie, S Miller 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 982-989, 2024 | 3 | 2024 |
| Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process P Lall, D Karakitie, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects P Lall, D Karakitie, S Miller International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures P Lall, V Soni, D Karakitie, S Miller International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Repairability of Additively Printed Circuits Using Sustainable Aqueous-Based Silver Nanoparticle Ink on Polyimide Substrates P Lall, D Karakitie, S Miller 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Biodegradable Substrates For Sustainable Aerosol-Jet Additively Printed Electronics P Lall, D Karakitie, S Miller 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
Professor David Abimbola FadareUniversity of Ibadan在 ui.edu.ng 的电子邮件经过验证
Professor David Abimbola FadareUniversity of Ibadan在 ui.edu.ng 的电子邮件经过验证