| Quality factors in micron-and submicron-thick cantilevers KY Yasumura, TD Stowe, EM Chow, T Pfafman, TW Kenny, BC Stipe, ... Journal of microelectromechanical systems 9 (1), 117-125, 2000 | 921 | 2000 |
| A high-performance planar piezoresistive accelerometer A Partridge, JK Reynolds, BW Chui, EM Chow, AM Fitzgerald, L Zhang, ... Journal of microelectromechanical systems 9 (1), 58-66, 2000 | 299 | 2000 |
| Stressed material and shape memory material MEMS devices and methods for manufacturing B Xu, DK Fork, MYT Young, EM Chow US Patent 7,372,348, 2008 | 139 | 2008 |
| Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates EM Chow, V Chandrasekaran, A Partridge, T Nishida, M Sheplak, ... Journal of Microelectromechanical systems 11 (6), 631-640, 2002 | 135 | 2002 |
| Scanning probe lithography HT Soh, KW Guarini, CF Quate Springer Science & Business Media, 2001 | 113 | 2001 |
| An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays CH Cheng, EM Chow, X Jin, S Ergun, BT Khuri-Yakub 2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium …, 2000 | 93 | 2000 |
| Intracellular calcium waves in bone cell networks under single cell nanoindentation XE Guo, E Takai, X Jiang, Q Xu, GM Whitesides, JT Yardley, CT Hung, ... Molecular & Cellular Biomechanics 3 (3), 95, 2006 | 78 | 2006 |
| Xerographic micro-assembler JP Lu, EM Chow US Patent 7,332,361, 2008 | 70 | 2008 |
| Imaging members for ink-based digital printing comprising structured organic films MA Heuft, EM Chow, AP Cote, NX Hu US Patent 8,119,315, 2012 | 66 | 2012 |
| Scanning probe system with spring probe and actuation/sensing structure T Hantschel, EM Chow, DK Fork, MA Rosa, D De Bruyker US Patent 6,734,425, 2004 | 62 | 2004 |
| Integration and packaging of a macrochip with silicon nanophotonic links JE Cunningham, AV Krishnamoorthy, R Ho, I Shubin, H Thacker, J Lexau, ... IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 546-558, 2011 | 61 | 2011 |
| Integration of through-wafer interconnects with a two-dimensional cantilever array EM Chow, HT Soh, HC Lee, JD Adams, SC Minne, G Yaralioglu, A Atalar, ... Sensors and Actuators A: Physical 83 (1-3), 118-123, 2000 | 60 | 2000 |
| Flexible cable interconnect assembly KF Van Schuylenbergh, AR Völkel, TH DiStefano, MA Rosa, DK Fork, ... US Patent 6,966,784, 2005 | 59 | 2005 |
| Point of care urine tester and method MI Recht, J Martini, A Ramkumar, P Kiesel, B Hsieh, EM Chow US Patent App. 14/307,193, 2015 | 52 | 2015 |
| Integrated driver electronics for MEMS device using high voltage thin film transistors JP Lu, EM Chow, JH Ho, C Shih US Patent 6,912,082, 2005 | 52 | 2005 |
| Scanning probe system with spring probe T Hantschel, EM Chow, DK Fork US Patent 6,668,628, 2003 | 49 | 2003 |
| Scanning probe system with spring probe T Hantschel, EM Chow, DK Fork US Patent 6,788,086, 2004 | 47 | 2004 |
| Patterned-print thin-film transistors with top gate geometry WS Wong, RA Lujan, EM Chow US Patent 7,344,928, 2008 | 45 | 2008 |
| 3D printed electronics S Ready, F Endicott, GL Whiting, TN Ng, EM Chow, JP Lu NIP & digital fabrication conference 29, 9-12, 2013 | 43 | 2013 |
| Characterization of a two-dimensional cantilever array with through-wafer electrical interconnects EM Chow, GG Yaralioglu, CF Quate, TW Kenny Applied Physics Letters 80 (4), 664-666, 2002 | 43 | 2002 |
