| Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers AM Caro, S Armini, O Richard, G Maes, G Borghs, CM Whelan, Y Travaly Advanced Functional Materials 20 (7), 1125-1131, 2010 | 75 | 2010 |
| Screening self-assembled monolayers as Cu diffusion barriers AM Caro, G Maes, G Borghs, CM Whelan Microelectronic engineering 85 (10), 2047-2050, 2008 | 59 | 2008 |
| Materials engineering for future interconnects:“catalyst-free” electroless Cu deposition on self-assembled monolayer alternative barriers S Armini, AM Caro Journal of the Electrochemical Society 157 (1), D74, 2009 | 21 | 2009 |
| Electrical properties of amino SAM layers studied with conductive AFM R Chintala, P Eyben, S Armini, AM Caro, J Loyo, Y Sun, W Vandervorst European polymer journal 49 (8), 1952-1956, 2013 | 13 | 2013 |
| Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias AM Caro, Y Travaly, G Beyer, Z Tokei, G Maes, G Borghs, S Armini Microelectronic engineering 106, 76-80, 2013 | 12 | 2013 |
| Stiction-free poly-SiGe resonators for monolithic integration of biosensors with CMOS S Lenci, F Pieri, L Haspeslagh, J De Coster, S Decoutere, AM Caro, ... 2011 16th International Solid-State Sensors, Actuators and Microsystems …, 2011 | 11 | 2011 |
| Evaluation of metallization options for advanced Cu interconnects application N Jourdan, L Carbonell, N Heylen, J Swerts, S Armini, AM Caro, ... ECS Transactions 34 (1), 515, 2011 | 10 | 2011 |
| Temperature insensitive conductance detection with surface-functionalised silicon nanowire sensors MA Ghiass, S Armini, M Carli, AM Caro, V Cherman, J Ogi, S Oda, ... Microelectronic engineering 88 (8), 1753-1756, 2011 | 4 | 2011 |
| High quality NH2SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects AM Caro, L Zhao, G Maes, G Borghs, G Beyer, Z Tőkei, S Armini, ... MRS Online Proceedings Library (OPL) 1249, 1249-F02-01, 2010 | 4 | 2010 |
| Electroless Cu Deposition on Self-assembled Monolayer Alternative Barriers S Armini, AM Caro MRS Online Proceedings Library (OPL) 1156, 1156-D04-08, 2009 | 3 | 2009 |
| Enhancing dielectric passivation on monolayer WS2 via a sacrificial graphene oxide seeding layer PJ Wyndaele, JF De Marneffe, S Sergeant, CJL De La Rosa, S Brems, ... npj 2D Materials and Applications 8 (1), 25, 2024 | 2 | 2024 |
| Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules AM Caro, Y Travaly, G Maes, G Borghs, S Armini 2011 IEEE International Interconnect Technology Conference, 1-3, 2011 | 1 | 2011 |
| Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules A Maestre Caro, Y Travaly, G Maes, G Borghs, S Armini | | 2011 |
| High quality NH2SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects A Maestre Caro, L Zhao, G Maes, G Borghs, G Beyer, Z Tokei, S Armini, ... MRS Online Proceedings Library 1249, 1-6, 2010 | | 2010 |
| Nanoscale selective silicon nanowires surface functionalization for sensing applications S Armini, M Carli, J Snauwaert, V Cherman, I De Wolf, V Simons, ... | | 2010 |
| NH2-terminated self-assembled monolayer as copper diffusion barrier: monolayer characterization A Maestre Caro, Y Travaly, S Armini | | 2009 |
| Engineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization A Maestre Caro | | 2008 |
| Self-assembled monolayers as Cu diffusion barriers for advanced interconections: molecular engineering A Maestre Caro, G Maes, G Borghs, C Whelan | | 2008 |
| Molecular engineering for future device structures: self-assembled monolayers as diffusion barriers for Cu metallization CM Whelan, AM Caro, F Clemente, G Beyer, Z Tokei, V Sutcliffe 2007 Digest of papers Microprocesses and Nanotechnology, 462-463, 2007 | | 2007 |
