| Viscoplastic characterization and mechanical strength of novel Sn–1.7 Ag–0.7 Cu lead-free solder alloys with microalloying of Te and Co AA El-Daly, AA Ibrahiem, MA Abdo, NAM Eid Journal of Materials Science: Materials in Electronics 30, 12937-12949, 2019 | 21 | 2019 |
| Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0 Ag-0.7 Cu low-Ag solder AA El-Daly, NAM Eid, AA Ibrahiem Journal of Alloys and Compounds 902, 163808, 2022 | 17 | 2022 |
| Development of Sn-1.0 Ag-0.7 Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT AA El-Daly, AA Ibrahiem, NAM Eid Journal of Materials Science: Materials in Electronics 32, 19871-19889, 2021 | 9 | 2021 |
| Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3 Cu matrix composite AA El-Daly, NAM Eid, AA Ibrahiem Materials Chemistry and Physics 295, 127209, 2023 | 6 | 2023 |
| Surface modification of Cu/PS nanocomposite films: A comparative study of DC N2 plasma and Gamma radiation and their effects on the films' antibacterial activity NM El-Sayed, NA Eid Arab Journal of Nuclear Sciences and Applications 53 (1), 88-96, 2020 | 2 | 2020 |
| Leveraging prior strain rates effect during stress relaxation of Sn–1.7 Ag–0.7 Cu lead-free alloys with microalloying of Te and Co for microelectronics applications AA El-Daly, KM Zohdy, MA Abdo, NAM Eid Journal of Materials Science: Materials in Electronics 30, 13757-13767, 2019 | 2 | 2019 |
| Mechanical property optimization of Sn-1.5 Ag-0.5 Cu solder alloys with additions of Bi, In, and Te NAM Eid, AA El-Daly, AA Ibrahiem Physica Scripta 99 (6), 0659a8, 2024 | 1 | 2024 |
| Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5 Cu matrix composite NAM Eid, AA El-Daly, AE Hammad, AA Ibrahiem Physica Scripta 98 (9), 095947, 2023 | 1 | 2023 |
| Microstructure, thermal analysis and stress relaxation behavior of Sn-1.5 Ag-0.5 Cu alloys with multiple strengthening mechanisms NA Eid, H Alsnani, AA El-Daly, AA Ibrahiem Physica Scripta, 2024 | | 2024 |
| Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3 Cu alloy NAM Eid, AM Attia, AA Ibrahiem, AE Hammad Journal of Materials Science: Materials in Electronics 34 (35), 2248, 2023 | | 2023 |
