| A coupled-inductor-based LCC resonant converter with the primary-parallel–secondary-series configuration to achieve output-voltage sharing for HV generator applications S Mao, Y Chen, C Li, W Li, J Popovic, JA Ferreira IEEE Transactions on Power Electronics 34 (7), 6108-6122, 2018 | 34 | 2018 |
| Graph-model-based generative layout optimization for heterogeneous SiC multichip power modules with reduced and balanced parasitic inductance Y Zhou, Y Jin, Y Chen, H Luo, W Li, X He IEEE Transactions on Power Electronics 37 (8), 9298-9313, 2022 | 21 | 2022 |
| Thermal mitigation and optimization via multitier bond wire layout for IGBT modules considering multicellular electro-thermal effect Y Chen, Q Wu, C Li, H Luo, Y Xia, Q Yin, W Li, X He IEEE Transactions on Power Electronics 37 (6), 7299-7314, 2022 | 12 | 2022 |
| Physics-based thermal impedance model for power module by analytic Fourier series based heat spreading angle Y Chen, Q Wu, Y Zhou Proc. CSEE 5 (3), 715-728, 2022 | 11 | 2022 |
| Non-contact degradation evaluation for IGBT modules using eddy current pulsed thermography approach X Liu, G Tian, Y Chen, H Luo, J Zhang, W Li Energies 13 (10), 2613, 2020 | 11 | 2020 |
| An online gate oxide degradation monitoring method for SiC MOSFETs with contactless PCB rogowski coil approach J Kang, A Zhu, Y Chen, H Luo, L Yao, Z Xin IEEE Transactions on Power Electronics 38 (8), 9673-9684, 2023 | 10 | 2023 |
| Chip Metallization Aging Monitoring with Induced Voltage veE between Kelvin and Power Emitter for High Power IGBT Modules Y Chen, F Meng, A Zhu, W Li, X He 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 4012-4016, 2020 | 6 | 2020 |
| A layout optimization method to reduce commutation inductance of multi-chip power module based on genetic algorithm Y Zhou, Y Chen, H Gao, C Li, H Luo, W Li, X He 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2021 | 5 | 2021 |
| 计及芯片导通压降温变效应的功率模块三维温度场解析建模方法 陈宇， 周宇， 罗皓泽， 李武华， 何湘宁 电工技术学报 36 (12), 2459-2470, 2021 | 5 | 2021 |
| Analytical 3D temperature field model for power module considering temperature effect of semiconductor voltage drop Y Chen, Y Zhou, H Luo Transactions of China Electrotechnical Society 36 (12), 2459-2470, 2021 | 5 | 2021 |
| 基于傅里叶级数解析热扩散角的功率模块热阻抗物理模型 陈宇， 吴强， 周宇 中国电机工程学报 42 (2), 715-728, 2022 | 3 | 2022 |
| Non-Magnetic Resonant-Type High-Frequency High-Voltage Power Conversion with Silicon Carbide Power Semiconductor Devices Y Chen, C Li, W Li, X He, S Mao, J Popovic, JA Ferreira 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018 | 3 | 2018 |
| A method for SiC MOSFETs gate oxide degradation monitoring based on turn-on di/dt delay time J Kang, Q Wu, Y Chen, H Xu, H Luo, Z Xin 2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific …, 2022 | 2 | 2022 |
| Research on the Limitation Value of Voltage Deviation for DC Distribution System M Han, Y Chen, H Wang High Power Converter Technology 2016 (03), 1-5, 2016 | 2 | 2016 |
| 基于模块化三电平方式的中压直流配电网 DC/DC 换流器设计 陈宇， 韩民晓， 王皓界， 盛万兴 电力建设, 69-77, 2016 | 2 | 2016 |
| 直流配电系统电压偏差限值的研究 韩民晓， 陈宇， 王皓界 大功率变流技术, 1-5, 2016 | 2 | 2016 |
| Layout-Dominated Electro-Thermal Optimization for Multichip Power Modules with Response Surface and Fourier Series Model Y Chen, A Zhu, H Luo, W Li, X He, H Yu, B Zhang, Y Zhao 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 1-6, 2023 | 1 | 2023 |
| Identification Method for Various Failure Modes with Shared Kelvin and Power Wires Configuration in IGBT Power Modules Q Wu, Y Chen, H Luo, J Zhang, W Li, X He, N Fujishima, H Nishio, ... 2022 International Power Electronics Conference (IPEC-Himeji 2022-ECCE Asia …, 2022 | 1 | 2022 |
| Uneven Current Mitigation in Single IGBT Chip with Multiple Metallization Regions Using Staggered Bonding Wires Layout A Zhu, J Mao, Y Chen, H Luo, W Li, X He 2021 IEEE 1st International Power Electronics and Application Symposium …, 2021 | 1 | 2021 |
| Junction Temperature and Current Perception of Silicon Thyristor Based on Electroluminescence Spectrum S Ye, Y Jin, B Yu, Y Chen, H Luo, C Li, W Li, X He 2024 IEEE 10th International Power Electronics and Motion Control Conference …, 2024 | | 2024 |
Haoze LuoAalborg University在 et.aau.dk 的电子邮件经过验证
