| Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder GR Mazumder, MA Haq, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 12 | 2022 |
| Vibration energy harvesting in a small channel fluid flow using piezoelectric transducer MM Hassan, MY Hossain, R Mazumder, R Rahman, MA Rahman AIP Conference Proceedings 1754 (1), 2016 | 10 | 2016 |
| Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling MA Haq, MA Hoque, GR Mazumder, JC Suhling, P Lall 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1472-1481, 2022 | 8 | 2022 |
| Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints S Chakraborty, D Mondal, GR Mazumder, MA Maruf, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 7 | 2023 |
| Incorporation of Damage in Creep Models for SAC305 Lead Free Solder GR Mazumder, S Chakraborty, MA Maruf, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 5 | 2023 |
| Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging MA Maruf, GR Mazumder, S Chakraborty, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 5 | 2023 |
| Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling GR Mazumder, S Chakraborty, JC Suhling, P Lall 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 2 | 2023 |
| Analytical and experimental studies on the damage evolution of SAC solder alloys S Glane, A Morozov, WH Müller, T Hauck, GR Mazumder, MA Haq, ... 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 2 | 2023 |
| A continuum damage mechanics approach for the reliability of lead-free solders subjected to cyclic loading GR Mazumder, MA Haq, JC Suhling, P Lall, Y Chen, T Hauck, A Fahim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 713-720, 2023 | 1 | 2023 |
| Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder GR Mazumder, S Chakraborty, MA Maruf, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Evolution of Mechanical Properties and Microstructure of SAC305 Lead Free Solder Subjected to Mechanical Cycling and High Temperature Aging MA Maruf, GR Mazumder, S Chakraborty, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Effects of Combined Isothermal Aging and Mechanical Cycling Exposures on the Mechanical Behavior of Lead-Free Solder Alloys MA Maruf, GR Mazumder, S Chakraborty, JC Suhling, P Lall 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Characterization of the Mechanical Response and Microstructure of iSAC Lead-Free Solder GR Mazumder, MA Maruf, S Chakraborty, JC Suhling, P Lall 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Mechanical Characterization and Modeling of iSAC Lead-Free Solder GR Mazumder, S Chakraborty, MA Maruf, M Al Ahsan, JC Suhling, P Lall 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1973-1980, 2024 | | 2024 |
| Evaluation of Electrical Impedance Tomography for the Localization of Lung Nodules GR Mazumder University of Minnesota, 2020 | | 2020 |
