| Color printer characterization using optimization theory and neural networks PA Drakopoulos, G Subbarayan US Patent 6,480,299, 2002 | 159 | 2002 |
| Constitutive and aging behavior of Sn3. 0Ag0. 5Cu solder alloy K Mysore, G Subbarayan, V Gupta, R Zhang IEEE Transactions on Electronics Packaging Manufacturing 32 (4), 221-232, 2009 | 155 | 2009 |
| Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008 | 127 | 2008 |
| Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan Jom 61, 29-38, 2009 | 119 | 2009 |
| Constructive solid analysis: a hierarchical, geometry-based meshless analysis procedure for integrated design and analysis D Natekar, X Zhang, G Subbarayan Computer-Aided Design 36 (5), 473-486, 2004 | 115 | 2004 |
| Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations SS Mahajan, G Subbarayan, BG Sammakia Physical Review E—Statistical, Nonlinear, and Soft Matter Physics 76 (5 …, 2007 | 81 | 2007 |
| A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces P Towashiraporn, G Subbarayan, CS Desai International Journal of Solids and Structures 42 (15), 4468-4483, 2005 | 79 | 2005 |
| An evaluation of back-propagation neural networks for the optimal design of structural systems: Part I. Training procedures L Zhang, G Subbarayan Computer Methods in Applied Mechanics and Engineering 191 (25-26), 2873-2886, 2002 | 78 | 2002 |
| An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008 | 68 | 2008 |
| Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011 | 59 | 2011 |
| Reliability simulations for solder joints using stochastic finite element and artificial neural network models G Subbarayan, Y Li, RL Mahajan | 58 | 1996 |
| High resolution characterization of materials used in packages through digital image correlation V Srinivasan, S Radhakrishnan, X Zhang, G Subbarayan, T Baughn, ... International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005 | 57 | 2005 |
| NURBS-based solutions to inverse boundary problems in droplet shape prediction FP Renken, G Subbarayan Computer methods in applied mechanics and engineering 190 (11-12), 1391-1406, 2000 | 49 | 2000 |
| Isogeometric enriched field approximations A Tambat, G Subbarayan Computer Methods in Applied Mechanics and Engineering 245, 1-21, 2012 | 46 | 2012 |
| CAD inspired hierarchical partition of unity constructions for NURBS‐based, meshless design, analysis and optimization M Rayasam, V Srinivasan, G Subbarayan International Journal for Numerical Methods in Engineering 72 (12), 1452-1489, 2007 | 46 | 2007 |
| A procedure for automated shape and life prediction in flip-chip and BGA solder joints G Subbarayan | 45 | 1996 |
| Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package P Towashiraporn, K Gall, G Subbarayan, B McIlvanie, BC Hunter, D Love, ... International journal of fatigue 26 (5), 497-510, 2004 | 44 | 2004 |
| An evaluation of back-propagation neural networks for the optimal design of structural systems: Part II. Numerical evaluation L Zhang, G Subbarayan Computer Methods in Applied Mechanics and Engineering 191 (25-26), 2887-2904, 2002 | 43 | 2002 |
| Thermo-elastic properties of dense YSZ and porous Ni-ZrO2 monolithic and isotropic materials S Gadag, G Subbarayan, W Barker Journal of materials science 41, 1221-1232, 2006 | 42 | 2006 |
| Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests P Towashiraporn, G Subbarayan, B McIlvanie, BC Hunter, D Love, ... Soldering & surface mount technology 14 (3), 51-60, 2002 | 42 | 2002 |
Bahgat G SammakiaBinghamton University在 binghamton.edu 的电子邮件经过验证
Bahgat G SammakiaBinghamton University在 binghamton.edu 的电子邮件经过验证
Sasanka KanuparthiProduct Development Engineer, Intel Corporation在 intel.com 的电子邮件经过验证