| A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding F Liu, RR Yu, AM Young, JP Doyle, X Wang, L Shi, KN Chen, X Li, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 132 | 2008 |
| Interconnect structure having improved metallization UMU Ahmad, AH Kumar, ED Perfecto, C Prasad, S Purushothaman, ... US Patent 5,436,412, 1995 | 110 | 1995 |
| Method for forming capped copper electrical interconnects MS Farooq, S Kaja, ED Perfecto, GE White US Patent 5,549,808, 1996 | 82 | 1996 |
| Line width control in a radiation sensitive polyimide M Angelopolus, DG Berger, ED Perfecto, PJ Wilkens US Patent 5,300,403, 1994 | 79 | 1994 |
| Process for releasing a thin-film structure from a substrate KA Kelly, AK Malhotra, ED Perfecto, R Yu US Patent 6,036,809, 2000 | 73 | 2000 |
| Capped copper electrical interconnects MS Farooq, S Kaja, ED Perfecto, GE White US Patent 5,898,222, 1999 | 59 | 1999 |
| Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure M McAllister, J McDonald, ED Perfecto, C Prasad, K Prasad, GJ Robbins, ... US Patent 5,757,079, 1998 | 59 | 1998 |
| Multilevel thin film packaging: Applications and processes for high performance systems K Prasad, E Perfecto IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994 | 58 | 1994 |
| Semiconductor device contact structure having stacked nickel, copper, and tin layers CL Arvin, HD Cox, ED Perfecto, TA Wassick US Patent 9,853,006, 2017 | 49 | 2017 |
| Method of making area direct transfer multilayer thin film structure ED Perfecto, C Prasad, GE White, KH Wong US Patent 5,534,466, 1996 | 49 | 1996 |
| Multilayered contact structure having nickel, copper, and nickel-iron layers CL Arvin, HD Cox, ED Perfecto, TA Wassick US Patent 9,396,991, 2016 | 48 | 2016 |
| Structure for establishing interconnects in packages using thin interposers BV Fasano, MS Cranmer, RF Indyk, H Cox, K Sakuma, ED Perfecto US Patent 10,002,835, 2018 | 42 | 2018 |
| Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages A Deutsch, M Swaminathan, MH Ree, CW Surovic, G Arjavalingam, ... IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994 | 39 | 1994 |
| Wafer IMS (injection molded solder)—A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility JW Nah, J Gelorme, P Sorce, P Lauro, E Perfecto, M McLeod, K Toriyama, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1308-1313, 2014 | 38 | 2014 |
| Multi-level thin-film electronic packaging structure and related method C Prasad, R Yu, RL Canull, G DiGiacomo, AP Giri, LS Goldmann, ... US Patent 6,281,452, 2001 | 37 | 2001 |
| Process for transferring a thin-film structure to a substrate KA Kelly, AK Malhotra, ED Perfecto, R Yu US Patent 6,183,588, 2001 | 35 | 2001 |
| Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding RR Yu, F Liu, RJ Polastre, KN Chen, XH Liu, L Shi, ED Perfecto, ... 2009 Symposium on VLSI Technology, 170-171, 2009 | 34 | 2009 |
| Capped copper electrical interconnects MS Farooq, S Kaja, ED Perfecto, GE White US Patent 5,545,927, 1996 | 34 | 1996 |
| Far back end of the line metallization method and structures TH Daubenspeck, JP Gambino, KP McLaughlin, E Misra, CD Muzzy, ... US Patent 8,937,009, 2015 | 29 | 2015 |
| C4NP technology: Manufacturability, yields and reliability ED Perfecto, D Hawken, HP Longworth, H Cox, K Srivastava, V Oberson, ... 2008 58th Electronic Components and Technology Conference, 1641-1647, 2008 | 29 | 2008 |
