| Analyzing the effects of pad asperity on chemical mechanical polishing of copper thin film wafer LNQ Huy, CY Lin, CCA Chen Japanese Journal of Applied Physics 61 (7), 071005, 2022 | 7 | 2022 |
| Development of modeling to investigate polyurethane pad hardness in chemical mechanical planarization/polishing (CMP) process LNQ Huy, CY Lin, CCA Chen Japanese Journal of Applied Physics 61 (SJ), SJ1002, 2022 | 7 | 2022 |
| An investigation of the Vickers hardness of polishing pads using simulations based on microtomography model LNQ Huy, LNQ Hoa Japanese Journal of Applied Physics 62, 056502, 2023 | 4 | 2023 |
| A Study on Force Analysis of Single Diamond Tools for Elastomer Polishing Pads Used in The Diamond Dressing Process LNQ Huy, LNQ Hoa International Conference on Precision Engineering and Sustainable …, 2023 | 2 | 2023 |
| Study On Force Analysis For Elastomer Pad By Single Diamond Tool LNQ Huy, LNQ Hoa, CCA Chen International Conference on Planarization Technology, 2022 | 2 | 2022 |
| Study On Evaluation Hardness of Porous Pad for chemical mechanical polishing LNQ Huy, CY Lin, CCA Chen National Conference on Mechanical Engineering of Chinese Society of …, 2021 | 2 | 2021 |
| Effects of Grits Size on Diamond Wire Sawing Process of Monocrystalline Silicon Wafers LNQ Huy, CCA Chen International Symposium on Precision Engineering and Sustainable …, 2021 | 2 | 2021 |
| Improving YOLO Object Detection Performance on Single-Board Computer using Virtual Machine MA Haq, LNQ Huy, N Fahriani Emerging Information Science and Technology 5 (1), 2024 | 1 | 2024 |
| Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure LNQ Huy, LNQ Hoa, CCA Chen The International Journal of Advanced Manufacturing Technology 128 (9-10 …, 2023 | 1 | 2023 |
| Automated Vickers hardness system with closed-loop control for polishing pads for semiconductor production LNQ Huy, LNQ Hoa, MA Haq, TT Huynh Instrumentation Science & Technology 52 (4), 401-414, 2024 | | 2024 |
| Investigation of the impact of environmental conditions on the mechanical properties of thin film copper wafers QP Pham, LNQ Hoa, MA Haq, LNQ Huy Japanese Journal of Applied Physics, 2024 | | 2024 |
| Effects of Cutting Parameters on Surface Roughness of Machining Marble with Diamond Disc QP Pham, MT Thach, PT Mai, LNQ Huy The 2024 International Conference on Research in Engineering and Technology …, 2024 | | 2024 |
| Study on Ductile-To-Brittle Transition Behavior in Fixed Diamond Abrasive Wire Sawing Process of Monocrystalline Silicon Ingot QP Pham, LNQ Hoa, MA Haq, LNQ Huy International Journal of Engineering Trends and Technology, 2024 | | 2024 |
| Leveraging Self-Attention Mechanism for Deep Learning in Hand-Gesture Recognition System MA Haq, LNQ Huy, M Ridlwan, I Naila E3S Web of Conferences 500, 01009, 2024 | | 2024 |
| Multi-Angle Facial Recognition: Enhancing Biometric Security with a Broadly Positioned Stereo-Camera System MA Haq, LNQ Huy, M Ridlwan, I Naila E3S Web of Conferences 500, 03032, 2024 | | 2024 |
| Investigation on Thin SiC As-Cut Wafer by Advanced Diamond Multi-Wire Sawing Assisted by Electrophoretic Deposition of Reactive Abrasives YH Tsai, DX Huang, TH Lai, LNQ Huy, CCA Chen The 25th International Symposium on Advances in Abrasive Technology, 2023 | | 2023 |
| Dishing Control and Surface Properties Improvement of Nano Twinned Copper/Polyimide (Nt-Cu/PI) Patterned Wafer by Electro- Kinetic Force Assisted Chemical Mechanical … C Jhong, YH Tsai, LS Lu, C Chen, LNQ Huy, CCA Chen International Conference on Planarization/CMP Technology, 2023 | | 2023 |
| Development of a Wet-type Pad Contact Area Measurement Apparatus for Cu-CMP LNQ Huy, YH Tsai, LNQ Hoa, CCA Chen International Conference on Planarization/CMP Technology, 2023 | | 2023 |
LE NGOC QUYNH HOAResearch Fellow在 mail.ntust.edu.tw 的电子邮件经过验证
