| MXene/polymer hybrid materials for flexible AC-filtering electrochemical capacitors GS Gund, JH Park, R Harpalsinh, M Kota, JH Shin, T Kim, Y Gogotsi, ... Joule 3 (1), 164-176, 2019 | 296 | 2019 |
| Cuticular pad–inspired selective frequency damper for nearly dynamic noise–free bioelectronics B Park, JH Shin, J Ok, S Park, W Jung, C Jeong, S Choy, YJ Jo, T Kim Science 376 (6593), 624-629, 2022 | 115 | 2022 |
| Biocompatible and biodegradable organic transistors using a solid‐state electrolyte incorporated with choline‐based ionic liquid and polysaccharide YJ Jo, H Kim, J Ok, YJ Shin, JH Shin, TH Kim, Y Jung, T Kim Advanced Functional Materials 30 (29), 1909707, 2020 | 77 | 2020 |
| Injectable biomedical devices for sensing and stimulating internal body organs YH Jung, JU Kim, JS Lee, JH Shin, W Jung, J Ok, T Kim Advanced Materials 32 (16), 1907478, 2020 | 68 | 2020 |
| Strain‐visualization with ultrasensitive nanoscale crack‐based sensor assembled with hierarchical thermochromic membrane B Park, JU Kim, J Kim, D Tahk, C Jeong, J Ok, JH Shin, D Kang, T Kim Advanced Functional Materials 29 (40), 1903360, 2019 | 49 | 2019 |
| Wearable EEG electronics for a Brain–AI Closed-Loop System to enhance autonomous machine decision-making JH Shin, J Kwon, JU Kim, H Ryu, J Ok, S Joon Kwon, H Park, T Kim npj Flexible Electronics 6 (1), 32, 2022 | 44 | 2022 |
| Highly stretchable and strain‐insensitive liquid metal based elastic kirigami electrodes (LM‐eKE) H Choi, Y Luo, G Olson, P Won, JH Shin, J Ok, YJ Yang, T Kim, C Majidi Advanced Functional Materials 33 (30), 2301388, 2023 | 31 | 2023 |
| Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing JS Lee, SJ Kang, JH Shin, YJ Shin, B Lee, JM Koo, T Kim Advanced Materials 32 (21), 1908422, 2020 | 30 | 2020 |
| Stretchable, patch‐type calorie‐expenditure measurement device based on pop‐up shaped nanoscale crack‐based sensor KY Kwon, YJ Shin, JH Shin, C Jeong, YH Jung, B Park, T Kim Advanced Healthcare Materials 8 (19), 1801593, 2019 | 27 | 2019 |
| Releasable high‐performance GaAs Schottky diodes for gigahertz operation of flexible bridge rectifier YH Jung, H Zhang, IK Lee, JH Shin, T Kim, Z Ma Advanced Electronic Materials 5 (2), 1800772, 2019 | 18 | 2019 |
| Polymeric conductive adhesive‐based ultrathin epidermal electrodes for long‐term monitoring of electrophysiological signals JH Shin, JY Choi, K June, H Choi, T Kim Advanced Materials, 2313157, 2024 | 3 | 2024 |
| Non-yellowish and heat-resistant adhesive for a transparent heat sinking film H Ryu, H Choi, J hwan Shin, H Hong, B Park, EG Lee, T Kim Journal of Industrial and Engineering Chemistry 103, 275-282, 2021 | 2 | 2021 |
| User interface system and an operation method thereof SK Paik, TI Kim, JH Shin US Patent App. 16/940,150, 2021 | 2 | 2021 |
| Biodegradable Organic Transistors: Biocompatible and Biodegradable Organic Transistors Using a Solid‐State Electrolyte Incorporated with Choline‐Based Ionic Liquid and … YJ Jo, H Kim, J Ok, YJ Shin, JH Shin, TH Kim, Y Jung, T Kim Advanced Functional Materials 30 (29), 2020 | 2 | 2020 |
| Highly Stretchable and Strain‐Insensitive Liquid Metal based Elastic Kirigami Electrodes (LM‐eKE)(Adv. Funct. Mater. 30/2023) H Choi, Y Luo, G Olson, P Won, JH Shin, J Ok, YJ Yang, T Kim, C Majidi Advanced Functional Materials 33 (30), 2370183, 2023 | | 2023 |
| Wearable device and wearable system SK Paik, TI Kim, JH Shin US Patent 11,550,390, 2023 | | 2023 |
| Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020) JS Lee, SJ Kang, JH Shin, YJ Shin, B Lee, JM Koo, T Kim Advanced Materials 32 (21), 2070161, 2020 | | 2020 |
