Efficient transient thermal analysis of chiplet heterogeneous integration C Nie, Q Xu, C Wang, H Cao, J Liu, Z Li Applied Thermal Engineering 229, 120609, 2023 | 13 | 2023 |
An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction C Wang, Q Xu, C Nie, H Cao, J Liu, Z Li Microelectronics Reliability 146, 115006, 2023 | 9 | 2023 |
An Electrical–Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems X Ma, Q Xu, C Wang, H Cao, J Liu, D Zhang, Z Li IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2024 | 3 | 2024 |
A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System C Wang, Q Xu, C Nie, H Cao, J Liu, D Zhang, Z Li IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | 3 | 2023 |
A Wafer-Scale heterogeneous integration thermal simulator Q Xu, C Wang, Z Li, D Zhang, X Ma, H Cao, J Liu Applied Thermal Engineering, 125459, 2025 | | 2025 |