| Electromigration in three-dimensional integrated circuits Z Shen, S Jing, Y Heng, Y Yao, KN Tu, Y Liu Applied Physics Reviews 10 (2), 2023 | 17 | 2023 |
| Thermally Resistant, Mechanically Robust, Enamel‐Inspired Hydroxyapatite/Polyethylene Nanocomposite Battery Separator H Yue, Y Yao, Y Li, L Ding, J Guo, X Tang, F Li, Y Sun, J Huang, H Zhong, ... Advanced Functional Materials 34 (7), 2308039, 2024 | 4 | 2024 |
| Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology Y Yao, Y An, KN Tu, Y Liu Journal of Materials Research and Technology 28, 3573-3582, 2024 | 2 | 2024 |
| Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology Y Yao, AM Gusak, C Chen, Y Liu, KN Tu Scripta Materialia 250, 116175, 2024 | | 2024 |
| Effect of Joule heating on the reliability of microbumps in 3D IC Y Yao, Y An, J Dong, Y Wang, KN Tu, Y Liu Journal of Materials Research and Technology 31, 3374-3382, 2024 | | 2024 |
| Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation Y Yao, Y An, KN Tu, Y Liu 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 316-319, 2023 | | 2023 |
| Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging Y Yao, Y An, KN Tu, Y Liu 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
Liu YingxiaCity University of Hong Kong在 cityu.edu.hk 的电子邮件经过验证
