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Vivek Manepalli
Vivek Manepalli
University of Maryland
在 umd.edu 的电子邮件经过验证
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An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
D Kong, E Jung, Y Kim, VV Manepalli, KJ Rah, HS Kim, Y Hong, HG Choi, ...
International Journal of Mechanical Sciences 248, 108228, 2023
342023
Design and modeling of hollow micropillars evaporator for thermal management in high heat flux applications: Numerical analysis
K Guye, V Manepalli, B Dogruoz, D Agonafer
Applied Thermal Engineering 262, 124977, 2025
12025
Hollow Micropillar Evaporator for Cooling Wide-Bandgap Silicon Carbide Power Converters
VV Manepalli, K Guye, E Song, A Dutton, D Luberda, Q Chau, Y Nayfeh, ...
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022
12022
3-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads
AM Randriambololona, V Manepalli, RC McAfee, B Ojha, R Miraftab-Salo, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
2024
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