Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration Y Li, AM Gheytaghi, M Trifunovic, Y Xu, GQ Zhang, R Ishihara Physica C: Superconductivity and its applications 582, 1353823, 2021 | 12 | 2021 |
3D Integration Technology for Quantum Computer based on Diamond Spin Qubits R Ishihara, J Hermias, S Yu, KY Yu, Y Li, S Nur, T Iwai, T Miyatake, ... 2021 IEEE International Electron Devices Meeting (IEDM), 14.5. 1-14.5. 4, 2021 | 6 | 2021 |