关注
Ye Li
Ye Li
Qove's Lab, CQT, NUS
在 u.nus.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration
Y Li, AM Gheytaghi, M Trifunovic, Y Xu, GQ Zhang, R Ishihara
Physica C: Superconductivity and its applications 582, 1353823, 2021
122021
3D Integration Technology for Quantum Computer based on Diamond Spin Qubits
R Ishihara, J Hermias, S Yu, KY Yu, Y Li, S Nur, T Iwai, T Miyatake, ...
2021 IEEE International Electron Devices Meeting (IEDM), 14.5. 1-14.5. 4, 2021
62021
系统目前无法执行此操作,请稍后再试。
文章 1–2