EPE improvement thru self-alignment via multi-color material integration N Mohanty, JT Smith, L Huli, C Pereira, A Raley, S Kal, C Fonseca, X Sun, ... Optical Microlithography XXX 10147, 13-25, 2017 | 14 | 2017 |
Method for fabricating NFET and PFET nanowire devices A Mosden, C Pereira, S Kal US Patent 10,573,564, 2020 | 9 | 2020 |
Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes M Korde, S Kal, C Pereira, N Keller, A Mosden, AC Diebold Metrology, Inspection, and Process Control for Microlithography XXXIII 10959 …, 2019 | 9 | 2019 |
Method for etch-based planarization of a substrate C Pereira, N Mohanty, L Huli US Patent 9,991,133, 2018 | 8 | 2018 |
Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors (Conference Presentation) S Kal, Y Oniki, M Falugh, C Pereira, Q Wang, F Holsteyns, J Smith, ... Advanced Etch Technology for Nanopatterning VIII 10963, 109630L, 2019 | 7 | 2019 |
Selective isotropic etching of Group IV semiconductors to enable gate all around device architectures S Kal, C Pereira, Y Oniki, F Holsteyns, J Smith, A Mosden, K Kumar, ... | 5 | 2018 |
Dry-plasma-free chemical etch technique for variability reduction in multi-patterning (Conference Presentation) S Kal, N Mohanty, RA Farrell, E Franke, A Raley, S Thibaut, C Pereira, ... Advanced Etch Technology for Nanopatterning VI 10149, 86-86, 2017 | 1 | 2017 |
Si trim applications: benefits and challenges S Kal, Y Oniki, C Alix, E Liu, K Pillai, D Chanemougame, F Holsteyns, ... | | 2019 |
Highly selective dry-plasma-free chemical etch technique for advanced patterning S Kal, N Mohanty, R Farrell, C Pereira, A Ko, A Mosden, P Biolsi | | |
Semiconductor scaling via self-aligned block patterning N Mohanty, J Smith, R Farrell, L Huli, C Pereira, D Hetzer, A Ko, ... | | |