| Fundamental cooling limits for high power density gallium nitride electronics Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson IEEE transactions on components, Packaging and Manufacturing Technology 5 (6 …, 2015 | 144 | 2015 |
| Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ... Advanced Functional Materials 27 (45), 1703265, 2017 | 103 | 2017 |
| Cooling limits for GaN HEMT technology Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-5, 2013 | 91 | 2013 |
| Layered manganese metal-organic framework with high specific and areal capacitance for hybrid supercapacitors PA Shinde, Y Seo, S Lee, H Kim, QN Pham, Y Won, SC Jun Chemical Engineering Journal 387, 122982, 2020 | 81 | 2020 |
| Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ... Journal of Electronic Packaging 138 (1), 010907, 2016 | 78 | 2016 |
| Deep learning predicts boiling heat transfer Y Suh, R Bostanabad, Y Won Scientific reports 11 (1), 5622, 2021 | 73 | 2021 |
| Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness J Lee, T Kodama, Y Won, M Asheghi, KE Goodson Journal of Applied Physics 112 (1), 2012 | 73 | 2012 |
| Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films Y Gao, T Kodama, Y Won, S Dogbe, L Pan, KE Goodson Carbon 50 (10), 3789-3798, 2012 | 63 | 2012 |
| Capillary wicking in hierarchically textured copper nanowire arrays J Lee, Y Suh, PP Dubey, MT Barako, Y Won ACS applied materials & interfaces 11 (1), 1546-1554, 2018 | 60 | 2018 |
| Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators Y Won, Y Gao, MA Panzer, S Dogbe, L Pan, TW Kenny, KE Goodson Carbon 50 (2), 347-355, 2012 | 60 | 2012 |
| Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films Y Won, Y Gao, MA Panzer, R Xiang, S Maruyama, TW Kenny, W Cai, ... Proceedings of the National Academy of Sciences 110 (51), 20426-20430, 2013 | 58 | 2013 |
| The Control of Colloidal Grain Boundaries through Evaporative Vertical Self‐Assembly Y Suh, Q Pham, B Shao, Y Won Small 15 (12), 1804523, 2019 | 46 | 2019 |
| High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 43 | 2016 |
| Boiling heat transfer with a well-ordered microporous architecture QN Pham, S Zhang, S Hao, K Montazeri, CH Lin, J Lee, A Mohraz, Y Won ACS applied materials & interfaces 12 (16), 19174-19183, 2020 | 41 | 2020 |
| Droplets on slippery lubricant-infused porous surfaces: A macroscale to nanoscale perspective QN Pham, S Zhang, K Montazeri, Y Won Langmuir 34 (47), 14439-14447, 2018 | 41 | 2018 |
| A deep learning perspective on dropwise condensation Y Suh, J Lee, P Simadiris, X Yan, S Sett, L Li, KF Rabbi, N Miljkovic, ... Advanced Science 8 (22), 2101794, 2021 | 37 | 2021 |
| Hierarchical and well-ordered porous copper for liquid transport properties control QN Pham, B Shao, Y Kim, Y Won ACS applied materials & interfaces 10 (18), 16015-16023, 2018 | 36 | 2018 |
| Microscopic analysis of thin-film evaporation on spherical pore surfaces K Montazeri, H Lee, Y Won International Journal of Heat and Mass Transfer 122, 59-68, 2018 | 34 | 2018 |
| Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness Y Won, J Lee, M Asheghi, TW Kenny, KE Goodson Applied physics letters 100 (16), 2012 | 32 | 2012 |
| Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density Gan-Sic chip T Liu, F Houshmand, C Gorle, S Scholl, H Lee, Y Won, M Asheghi, ... International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 31 | 2015 |
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor在 stanford.edu 的电子邮件经过验证
