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Jinhyoung Lee
Jinhyoung Lee
Sungkyunkwan University M.S & Ph.D Combined Course
在 g.skku.edu 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Flexible and stretchable optical fiber strain sensor based on nanoparticles and polymer for human motion detection
D Shin, J Lee, T Kim, H Seok
2022 IEEE International Symposium on Medical Measurements and Applications …, 2022
32022
Remote‐Controllable Interfacial Electron Tunneling at Heterogeneous Molecular Junctions via Tip‐Induced Optoelectrical Engineering
J Lee, E Kim, J Cho, H Seok, G Woo, D Yu, G Jung, H Hwangbo, J Na, I Im, ...
Advanced Science 11 (5), 2470032, 2024
12024
Investigation of the removal mechanism in amorphous carbon chemical mechanical polishing for achieving an atomic-scale roughness
Z Wang, P Liu, S Lee, J Lee, H Lee, H Kim, S Oh, T Kim
Applied Surface Science 671, 160721, 2024
2024
Ultrastable 3D Heterogeneous Integration via N-Heterocyclic Carbene Self-Assembled Nanolayers
J Lee, G Woo, G Lee, J Jeon, S Lee, Z Wang, H Shin, GW Lee, YJ Kim, ...
ACS Applied Materials & Interfaces 16 (27), 35505-35515, 2024
2024
Free-standing two-dimensional ferro-ionic memristor
J Lee, G Woo, J Cho, S Son, H Shin, H Seok, MJ Kim, E Kim, Z Wang, ...
Nature Communications 15 (1), 5162, 2024
2024
Unlocking of Schottky Barrier Near the Junction of MoS2 Heterostructure Under Electrochemical Potential
K Aydin, M Kim, H Seok, C Bae, J Lee, M Kim, J Park, JT Hupp, D Whang, ...
Energy & Environmental Materials, e12800, 2024
2024
Remote‐Controllable Interfacial Electron Tunneling at Heterogeneous Molecular Junctions via Tip‐Induced Optoelectrical Engineering (Adv. Sci. 5/2024)
J Lee, E Kim, J Cho, H Seok, G Woo, D Yu, G Jung, H Hwangbo, J Na, I Im, ...
Advanced Science 11 (5), 2470032, 2024
2024
Electrostatic-Induced Particle Behavior Simulation Framework in Cleaning Process: Interaction between Solid-Liquid Interfaces
JH Lee, JK Hwang, DJ Shin, TS Kim
Solid State Phenomena 346, 280-285, 2023
2023
Thermal Effects of SPM Solution for Polished SiO2 film and Adsorbed Ceria Nano-particles on Single Wafer Cleaning
K Park, C Yao, J Lee, S Jeon, P Liu, T Kim, Y Ahn
Analysis of Corrosion Inhibitor Effects in Cu CMP Based on AFM Measurements
J Lee, E Kim, T Kim
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