| Mitigation of layered to spinel conversion of a Li-rich layered metal oxide cathode material for Li-ion batteries MN Ates, Q Jia, A Shah, A Busnaina, S Mukerjee, KM Abraham Journal of The Electrochemical Society 161 (3), A290, 2013 | 213 | 2013 |
| The adhesion of dry particles in the nanometer to micrometer-size range DS Rimai, DJ Quesnel, AA Busnaina Colloids and surfaces A: Physicochemical and engineering aspects 165 (1-3), 3-10, 2000 | 173 | 2000 |
| Particle adhesion and removal in chemical mechanical polishing and post‐CMP cleaning F Zhang, AA Busnaina, G Ahmadi Journal of the Electrochemical Society 146 (7), 2665, 1999 | 151 | 1999 |
| Particle adhesion and removal mechanisms in post-CMP cleaning processes AA Busnaina, H Lin, N Moumen, J Feng, J Taylor IEEE transactions on semiconductor manufacturing 15 (4), 374-382, 2002 | 139 | 2002 |
| An experimental study of megasonic cleaning of silicon wafers AA Busnaina, II Kashkoush, GW Gale Journal of the Electrochemical Society 142 (8), 2812, 1995 | 129 | 1995 |
| Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning JG Park, SH Lee, JS Ryu, YK Hong, TG Kim, AA Busnaina Journal of the Electrochemical society 153 (9), G811, 2006 | 124 | 2006 |
| Method and apparatus to process substrates with megasonic energy GL Montierth, HR Miranda, SL Maraviov, AA Busnaina US Patent 7,238,085, 2007 | 118 | 2007 |
| Removal of particulate contaminants using ultrasonics and megasonics: a review GW Gale, AA Busnaina Particulate science and Technology 13 (3-4), 197-211, 1995 | 111 | 1995 |
| A nanoparticle convective directed assembly process for the fabrication of periodic surface enhanced Raman spectroscopy substrates V Liberman, C Yilmaz, TM Bloomstein, S Somu, Y Echegoyen, ... Adv. Mater 22 (38), 4298-4302, 2010 | 106 | 2010 |
| Building highly organized single‐walled‐carbon‐nanotube networks using template‐guided fluidic assembly X Xiong, L Jaberansari, MG Hahm, A Busnaina, YJ Jung Small 3 (12), 2006-2010, 2007 | 105 | 2007 |
| The role of particle adhesion and surface deformation in chemical mechanical polishing processes F Zhang, A Busnaina Electrochemical and Solid-State Letters 1 (4), 184, 1998 | 104 | 1998 |
| The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics F Zhang, AA Busnaina, MA Fury, SQ Wang Journal of Electronic Materials 29, 199-204, 2000 | 102 | 2000 |
| Monopole antenna arrays for optical trapping, spectroscopy, and sensing AE Cetin, AA Yanik, C Yilmaz, S Somu, A Busnaina, H Altug Applied Physics Letters 98 (11), 2011 | 100 | 2011 |
| A reusable high aspect ratio parylene-C shadow mask technology for diverse micropatterning applications S Selvarasah, SH Chao, CL Chen, S Sridhar, A Busnaina, ... Sensors and Actuators A: Physical 145, 306-315, 2008 | 95 | 2008 |
| Wall deposition of aerosol particles in a turbulent channel flow S Abuzeid, AA Busnaina, G Ahmadi Journal of Aerosol Science 22 (1), 43-62, 1991 | 94 | 1991 |
| Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time K Bakhtari, RO Guldiken, P Makaram, AA Busnaina, JG Park Journal of the electrochemical society 153 (9), G846, 2006 | 91 | 2006 |
| Highly aligned scalable platinum-decorated single-wall carbon nanotube arrays for nanoscale electrical interconnects YL Kim, B Li, X An, MG Hahm, L Chen, M Washington, PM Ajayan, ... ACS nano 3 (9), 2818-2826, 2009 | 86 | 2009 |
| Roles of cavitation and acoustic streaming in megasonic cleaning GW GALE, AA Busnaina Particulate science and technology 17 (3), 229-238, 1999 | 84 | 1999 |
| The adhesion-induced deformation and the removal of submicrometer particles S Krishnan, AA Busnaina, DS Rimai, LP Demejo Journal of adhesion science and technology 8 (11), 1357-1370, 1994 | 81 | 1994 |
| Nanomanufacturing handbook A Busnaina CRC press, 2017 | 80 | 2017 |
Sivasubramanian SomuResearch Associate Professor Northeastern University在 neu.edu 的电子邮件经过验证
