| Chemical interaction at the interface of metal–plastic direct joints fabricated via injection molded direct joining S Zhao, F Kimura, S Wang, Y Kajihara Applied Surface Science 540, 148339, 2021 | 62 | 2021 |
| Experimental analysis on mechanical interlocking of metal–polymer direct joining S Zhao, F Kimura, S Kadoya, Y Kajihara Precision Engineering 61, 120-125, 2020 | 51 | 2020 |
| Manufacturing aluminum/polybutylene terephthalate direct joints by using hot water–treated aluminum via injection molding S Zhao, F Kimura, E Yamaguchi, N Horie, Y Kajihara The International Journal of Advanced Manufacturing Technology 107, 4637-4644, 2020 | 32 | 2020 |
| Influence of fluidity improver on metal-polymer direct joining via injection molding S Wang, F Kimura, S Zhao, E Yamaguchi, Y Ito, Y Kajihara Precision Engineering 72, 620-626, 2021 | 23 | 2021 |
| Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests C Chen, D Kim, Z Zhang, N Wakasugi, Y Liu, MC Hsieh, S Zhao, ... IEEE Transactions on Power Electronics 37 (6), 6647-6659, 2022 | 18 | 2022 |
| Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature S Zhao, C Chen, M Haga, M Ueshima, H Hirahara, J Sang, S hun Cho, ... Composites Part B: Engineering 254, 110562, 2023 | 13 | 2023 |
| Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions C Chen, S Zhao, T Sekiguchi, K Suganuma Journal of Science: Advanced Materials and Devices 8 (3), 100606, 2023 | 7 | 2023 |
| Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors S Zhao, C Chen, M Haga, M Ueshima, K Suganuma Applied Surface Science 608, 155165, 2023 | 7 | 2023 |
| Experimental investigation of the anchoring effect of aluminum/amorphous-plastics joints fabricated by injection molded direct joining S Zhao, A Takeuchi, F Kimura, Y Kajihara Precision Engineering 77, 320-327, 2022 | 7 | 2022 |
| Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate S Zhao, C Chen, M Haga, M Ueshima, H Suzuki, H Takenaka, H Hirahara, ... Microelectronics Reliability 149, 115211, 2023 | 6 | 2023 |
| Effects of high temperature and high humidity on the reliability of copper/epoxy bond S Zhao, C Chen, M Nishijima, R Okumura, M Haga, M Ueshima, H Suzuki, ... Applied Surface Science 660, 159970, 2024 | 1 | 2024 |
| Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach S Zhao, C Chen, H Liang, S Wang, F Kimura, Y Kajihara Applied Surface Science 656, 159694, 2024 | 1 | 2024 |
| Copper diffusion into epoxy under high temperature S Zhao, C Chen, M Nishijima, M Haga, M Ueshima, H Suzuki, ... Materials Letters 361, 136157, 2024 | 1 | 2024 |
| An abnormal phenomenon observed for copper/epoxy bonding after 85° C/85% relative humidity test and its possibile mechanism S Zhao, C Chen, M Ueshima, M Haga, H Suzuki, H Takenaka, ... マイクロエレクトロニクスシンポジウム論文集 第 33 回マイクロエレクトロニクスシンポジウム, 429-432, 2023 | 1 | 2023 |
| Self-assembled layer as an effective way to block copper diffusion into epoxy S Zhao, C Chen, M Nishijima, M Haga, M Ueshima, H Suzuki, ... Materials Letters 367, 136589, 2024 | | 2024 |
| Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer S Zhao, C Chen, M Haga, M Ueshima, H Suzuki, H Takenaka, ... 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
| Statistical and Artificial Intelligence Analyses of Blast Treatment Condition Effects on Blast-Assisted Injection Molded Direct Joining S Wang, F Kimura, S Zhao, E Yamaguchi, Y Ito, Y Suzuki, Y Kajihara International Journal of Automation Technology 17 (2), 156-166, 2023 | | 2023 |
| Chemical bonding copper and epoxy through self-assembled layer S Zhao, C Chen, M Ueshima, M Haga, K Suganuma 2022 International Conference on Electronics Packaging (ICEP), 123-124, 2022 | | 2022 |
| Bonding reliability of encapsulation epoxy and substrate for power modules under high-temperature agin S Zhao, C Chen, M Ueshima, M Haga, K Suganuma マイクロエレクトロニクスシンポジウム論文集 第 32 回マイクロエレクトロニクスシンポジウム, 265-268, 2022 | | 2022 |
| Evaluations of flow modifier to joint performance in injection molded direct joining S Wang, F Kimura, S Zhao, E Yamaguchi, Y Ito, Y Kajihara Proceedings of JSPE Semestrial Meeting 2021 JSPE Spring Conference, 80-81, 2021 | | 2021 |
Yusuke KajiharaThe University of Tokyo在 iis.u-tokyo.ac.jp 的电子邮件经过验证
Yusuke KajiharaThe University of Tokyo在 iis.u-tokyo.ac.jp 的电子邮件经过验证
Chuantong ChenOsaka University在 sanken.osaka-u.ac.jp 的电子邮件经过验证
Hang LiangTianjin University在 tju.edu.cn 的电子邮件经过验证