| Recent advances in nano-materials for packaging of electronic devices S Zhang, X Xu, T Lin, P He Journal of Materials Science: Materials in Electronics 30 (15), 13855–13868, 2019 | 144 | 2019 |
| Two-step separation of chitin from shrimp shells using citric acid and deep eutectic solvents with the assistance of microwave D Zhao, WC Huang, N Guo, S Zhang, C Xue, X Mao Polymers 11 (3), 409, 2019 | 109 | 2019 |
| Molecular level manipulation of charge density for solid-liquid TENG system by proton irradiation D Wang, XX Wang, ML Jin, P He, S Zhang Nano Energy 103, 107819, 2022 | 102 | 2022 |
| An ultrastable ionic chemiresistor skin with an intrinsically stretchable polymer electrolyte ML Jin, S Park, JS Kim, SH Kwon, S Zhang, MS Yoo, S Jang, HJ Koh, ... Advanced Materials 30 (20), 1706851, 2018 | 96 | 2018 |
| Corrosion behavior of Sn‑based lead‑free solder alloys: a review S Li, X Wang, Z Liu, Y Jiu, S Zhang, J Geng, X Chen, S Wu, P He, W Long Journal of Materials Science: Materials in Electronics, 2020 | 93 | 2020 |
| Ultrathin nanofibrous membranes containing insulating microbeads for highly sensitive flexible pressure sensors T Jin, Y Pan, GJ Jeon, HI Yeom, S Zhang, KW Paik, SHK Park ACS applied materials & interfaces 12 (11), 13348-13359, 2020 | 85 | 2020 |
| Effect of boron on the structural stability, mechanical properties, and electronic structures of γ′-Ni3Al in TLP joints of nickel-based single-crystal alloys Y Wu, J Chen, L Zhang, J Ji, Q Wang, S Zhang Materials Today Communications 31, 103375, 2022 | 82 | 2022 |
| Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake J Kim, J Kim, S Song, S Zhang, J Cha, K Kim, H Yoon, Y Jung, KW Paik, ... Carbon 113, 379-386, 2017 | 78 | 2017 |
| The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation … Q Wang, S Zhang, G Liu, T Lin, P He Journal of Alloys and Compounds 820, 153184, 2020 | 77 | 2020 |
| Cu-Cu joining using citrate coated ultra-small nano-silver pastes S Zhang, Q Wang, T Lin, P Zhang, P He, KW Paik Journal of Manufacturing Processes 62, 546-554, 2021 | 62 | 2021 |
| Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air Q Wang, S Zhang, T Lin, P Zhang, P He, KW Paik Progress in Natural Science: Materials International, 2021 | 58 | 2021 |
| Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties M Yang, SW Kim, S Zhang, DY Park, CW Lee, YH Ko, H Yang, Y Xiao, ... Journal of Materials Chemistry C 6 (27), 7207-7218, 2018 | 58 | 2018 |
| Challenges and recent prospectives of 3D heterogeneous integration S Zhang, Z Li, H Zhou, R Li, S Wang, KW Paik, P He E-Prime-Advances in Electrical Engineering, Electronics and Energy 2, 100052, 2022 | 53 | 2022 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives S Zhang, X Qi, M Yang, Y Cao, T Lin, P He, KW Paik Journal of Materials Science: Materials in Electronics 30, 9171-9183, 2019 | 53 | 2019 |
| Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints J Wang, J Chen, Z Zhang, P Zhang, Z Yu, S Zhang Soldering & Surface Mount Technology 34 (2), 124-133, 2021 | 51 | 2021 |
| Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review J Wang, J Chen, L Zhang, Z Zhang, Y Han, X Hu, H Lu, S Zhang Journal of Advanced Joining Processes 6, 100125, 2022 | 49 | 2022 |
| Characterization of multiple-filled skutterudites with high thermoelectric performance S Zhang, S Xu, H Gao, Q Lu, T Lin, P He, H Geng Journal of Alloys and Compounds 814, 152272, 2020 | 48 | 2020 |
| Scalable superior chemical sensing performance of stretchable ionotronic skin via a π‐hole receptor effect ML Jin, S Park, H Kweon, HJ Koh, M Gao, C Tang, SY Cho, Y Kim, ... Advanced Materials 33 (13), 2007605, 2021 | 45 | 2021 |
| A study on the failure mechanism and enhanced reliability of Sn58Bi solder anisotropic conductive film joints in a pressure cooker test due to polymer viscoelastic properties … S Zhang, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 40 | 2016 |
| Wettability and interfacial morphology of Sn–3.0 Ag–0.5 Cu solder on electroless nickel plated ZnS transparent ceramic S Zhang, B Zhu, X Zhou, X Wang, T Lin, P He, KW Paik Journal of Materials Science: Materials in Electronics 30, 17972-17985, 2019 | 35 | 2019 |
Dr. MING LIANG JINKAIST在 kaist.ac.kr 的电子邮件经过验证
