| Effect of contact metallization on electromigration reliability of Pb-free solder joints M Ding, G Wang, B Chao, PS Ho, P Su, T Uehling Journal of applied physics 99 (9), 2006 | 114 | 2006 |
| Reactions of lead-free solders with CuNi metallizations TM Korhonen, P Su, SJ Hong, MA Korhonen, CY Li Journal of electronic materials 29, 1194-1199, 2000 | 85 | 2000 |
| Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages KN Subramanian, SH Chae, X Zhang, KH Lu, HL Chao, PS Ho, M Ding, ... Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 83 | 2007 |
| Humidity effects on Sn whisker formation P Oberndorff, M Dittes, P Crema, P Su, E Yu IEEE Transactions on Electronics Packaging Manufacturing 29 (4), 239-245, 2006 | 73 | 2006 |
| An evaluation of effects of molding compound properties on reliability of Cu wire components P Su, H Seki, C Ping, S Zenbutsu, S Itoh, L Huang, N Liao, B Liu, C Chen, ... 2011 IEEE 61st Electronic components and technology conference (ECTC), 363-369, 2011 | 72 | 2011 |
| Microstructure-based stress modeling of tin whisker growth JH Zhao, P Su, M Ding, S Chopin, PS Ho IEEE transactions on electronics packaging manufacturing 29 (4), 265-273, 2006 | 64 | 2006 |
| Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications HC Chien, JH Lau, YL Chao, MJ Dai, RM Tain, L Li, P Su, J Xue, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1866-1873, 2012 | 55 | 2012 |
| Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration L Li, P Su, J Xue, M Brillhart, J Lau, PJ Tzeng, CK Lee, CJ Zhan, MJ Dai, ... 2012 IEEE 62nd electronic components and technology conference, 1040-1046, 2012 | 51 | 2012 |
| Mechanical integrity evaluation of low-k devices with bump shear P Su, SK Pozder, DG Wontor, JH Zhao US Patent 7,622,309, 2009 | 51 | 2009 |
| A statistical study of Sn whisker population and growth during elevated temperature and humidity tests P Su, J Howell, S Chopin IEEE transactions on electronics packaging manufacturing 29 (4), 246-251, 2006 | 50 | 2006 |
| The effects of underfill on the reliability of flip chip solder joints P Su, S Rzepka, M Korhonen, CY Li Journal of electronic Materials 28, 1017-1022, 1999 | 49 | 1999 |
| Defect morphology and texture in Sn, Sn–Cu, and Sn–Cu–Pb electroplated films P Sarobol, AE Pedigo, P Su, JE Blendell, CA Handwerker IEEE transactions on electronics packaging manufacturing 33 (3), 159-164, 2010 | 42 | 2010 |
| Effects of reflow on the microstructure and whisker growth propensity of Sn finish P Su, M Ding, S Chopin Proceedings Electronic Components and Technology, 2005. ECTC'05., 434-440, 2005 | 41 | 2005 |
| Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages SH Chae, X Zhang, HL Chao, KH Lu, PS Ho, M Ding, P Su, T Uehling, ... 56th Electronic Components and Technology Conference 2006, 7 pp., 2006 | 32 | 2006 |
| Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation P Sarobol, WH Chen, AE Pedigo, P Su, JE Blendell, CA Handwerker Journal of Materials Research 28 (5), 747-756, 2013 | 27 | 2013 |
| Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films P Sarobol, JP Koppes, WH Chen, P Su, JE Blendell, CA Handwerker Materials Letters 99, 76-80, 2013 | 26 | 2013 |
| A study of electromigration failure in Pb-free solder joints M Ding, G Wang, B Chao, PS Ho, P Su, T Uehling, D Wontor 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings …, 2005 | 26 | 2005 |
| Tin whisker test development—temperature and humidity effects part I: Experimental design, observations, and data collection HL Reynolds, JW Osenbach, G Henshall, RD Parker, P Su IEEE transactions on electronics packaging manufacturing 33 (1), 1-15, 2009 | 24 | 2009 |
| Tin whisker test development—temperature and humidity effects part II: Acceleration model development JW Osenbach, HL Reynolds, G Henshall, RD Parker, P Su IEEE transactions on electronics packaging manufacturing 33 (1), 16-24, 2009 | 22 | 2009 |
| Development of under bump metallizations for flip chip bonding to organic substrates TM Korhonen, P Su, SJ Hong, MA Korhonen, CY Li Journal of electronic materials 28, 1146-1149, 1999 | 22 | 1999 |
