| Schottky barrier height modification of metal/4H-SiC contact using ultrathin TiO2 insertion method BY Tsui, JC Cheng, LS Lee, CY Lee, MJ Tsai Japanese Journal of Applied Physics 53 (4S), 04EP10, 2014 | 23 | 2014 |
| Effects of rapid thermal annealing on Ar inductively coupled plasma-treated n-type 4H-SiC Schottky and ohmic contacts JC Cheng, BY Tsui IEEE Transactions on Electron Devices 65 (9), 3739-3745, 2018 | 15 | 2018 |
| Strong Fermi-level pinning induced by argon inductively coupled plasma treatment and post-metal deposition annealing on 4H-SiC BY Tsui, JC Cheng, CT Yen, CY Lee Solid-State Electronics 133, 83-87, 2017 | 15 | 2017 |
| Reduction of specific contact resistance on n-type implanted 4H-SiC through argon inductively coupled plasma treatment and post-metal deposition annealing JC Cheng, BY Tsui IEEE Electron Device Letters 38 (12), 1700-1703, 2017 | 10 | 2017 |
| Effect of ion-implantation temperature on contact resistance of metal/n-type 4H-SiC with Ar plasma treatment BY Tsui, JC Cheng IEEE Transactions on Electron Devices 66 (3), 1464-1467, 2019 | 6 | 2019 |
| Multi-gate non-volatile memories with nanowires as charge storage material BY Tsui, PY Wang, TY Chen, JC Cheng Microelectronics Reliability 50 (5), 603-606, 2010 | 6 | 2010 |
| Schottky barrier diodes isolated by local oxidation of SiC (LOCOSiC) using pre-amorphization implantation technology JC Cheng, JE Lee, BY Tsui Solid-State Electronics 171, 107834, 2020 | 3 | 2020 |
| Failure analysis on TiAl metallization process for ohmic contact on 4H-SiC pMOSFET CL Hung, JC Cheng, BY Tsui 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 3 | 2019 |
| High voltage gain 4H-SiC CMOS technology featuring LOCal oxidation of SiC (LOCOSiC) isolation and balanced gate dielectric BY Tsui, CL Hung, YR Jhuang, YT Huang, JC Cheng, FH Lu, YT Shih, ... 2021 International Symposium on VLSI Technology, Systems and Applications …, 2021 | 2 | 2021 |
| Schottky Barrier Height Modulation of the Metal/4H-SiC Contact by Ultra-Thin Dielectric Insertion Technique BY Tsui, JC Cheng, LS Lee, CY Lee, MJ Tsai | | |
