Enhanced thermal conductivity in a nanostructured phase change composite due to low concentration graphene additives F Yavari, HR Fard, K Pashayi, MA Rafiee, A Zamiri, Z Yu, R Ozisik, ... The Journal of Physical Chemistry C 115 (17), 8753-8758, 2011 | 485 | 2011 |
Large Area Free-Standing Graphene Paper for Superior Thermal Management G Xin, H Sun, T Hu, H Raeisi Fard, N Koratkar, T Borca-Tasciuc, J Lian Advanced Materials, 2014 | 454 | 2014 |
High thermal conductivity epoxy-silver composites based on self-constructed nanostructured metallic networks K Pashayi, HR Fard, F Lai, S Iruvanti, J Plawsky, T Borca-Tasciuc Journal of applied physics 111 (10), 2012 | 152 | 2012 |
A novel approach to enhance the thermal conductivity of epoxy nanocomposites using graphene core–shell additives O Eksika, SF Bartolucci, T Gupta, H Fard, T Borca-Tasciuc, N Koratkar Carbon 101, 239-244, 2016 | 145 | 2016 |
Engineering the coefficient of thermal expansion and thermal conductivity of polymers filled with high aspect ratio silica nanofibers RO Liyun Ren, Kamyar Pashayi, Hafez Raeisi Fard Composites Part B, 2013 | 86* | 2013 |
Self-Constructed Tree-Shape High Thermal Conductivity Nanosilver Networks in Epoxy K Pashayi, H Raeisi Fard, F Lai, J Plawsky, T Borca-Tasciuc Nanoscale, 2014 | 50 | 2014 |
Static characterization and pull-in voltage of a micro-switch under both electrostatic and piezoelectric excitations HR Hamed Raeisi Fard, Mansour Nikkhah Bahrami, Aghil European Journal of Mechanics - A/Solids, 2013 | 39* | 2013 |
ee, A. Zamiri, Z. Yu, R. Ozisik, T. Borca-Tasciuc and N. Koratkar F Yavari, HR Fard, K Pashayi, MA Ra J. Phys. Chem. C 115 (17), 8753, 2011 | 23 | 2011 |
HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOSTRUCTURED METALLIC NETWORK-POLYMER COMPOSITES S Iruvanti, T Borca-Tasciuc, H Raeisi-Fard, F Lai, K Pashayi, J Plawsky, ... US Patent App. 13/357,190, 2012 | 15 | 2012 |
Thermal Conductivity of Er+3:Y2O3 films grown by Atomic Layer Deposition H Raeisi Fard, et al Applied Physics Letters 103 (19), 193109, 2013 | 11 | 2013 |
On the nonlinear primary resonances of a piezoelectric laminated micro system under electrostatic control voltage H Raeisifard, M Zamanian, MN Bahrami, A Yousefi-Koma, HR Fard Journal of Sound and Vibration 333 (21), 5494-5510, 2014 | 9 | 2014 |
Reducing thermal interface impedance using surface engineering HR Fard, R Karlicek, J Plawsky, T Borca-Tasciuc Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 4 | 2014 |
Experimental Investigation of R454C as a Replacement for R410A in a Residential Heat Pump Split System DZ Weigang Hou, Hafez Raeisi Fard, Larry Burns, Eckhard A. Groll INTERNATIONAL REFRIGERATION AND AIR CONDITIONING CONFERENCE, 2022 | 3* | 2022 |
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites T Borca-Tasciuc, S Iruvanti, F Lai, K Pashayi, J Plawsky, H Raeisi-Fard US Patent 9,512,291, 2016 | 3 | 2016 |
Heat Conduction in High Thermal Conductivity Networked Composite Films for Thermal Interface Materials HR Fard, K Pashayi, F Lai, J Plawsky, T Borca-Tasciuc ASME, 2011 | 3 | 2011 |
Modeling and Simulation of Controlled Manipulation by AFM Nano Robot AK Hoshiar, MR Khalili, MH Nejad, HR Fard Applied Mechanics and Materials 110, 3688-3695, 2012 | 1 | 2012 |
Heat Exchanger Optimization for Low-GWP R454C Working as a Replacement for R410A in a Residential Heat Pump System DZ Weigang Hou, Hafez Raeisi Fard, Larry Burns, Eckhard A. Groll, James E. Braun International Congress of Refrigeration, 2023 | | 2023 |
Effect of Patterned Surfaces on Thermal Impedance Reduction HR Fard Rensselaer Polytechnic Institute, 2014 | | 2014 |
Thermal conductivity of Er {sup+ 3}: Y {sub 2} O {sub 3} films grown by atomic layer deposition H Raeisi Fard, A Hess, K Pashayi, T Borca-Tasciuc, N Becker, T Proslier, ... Applied Physics Letters 103 (19), 2013 | | 2013 |
Modeling and Simulation of Nano Structures Based on Molecular Dynamics AK Hoshiar, HR Fard, MM Kheirikhah, HR Fard Applied Mechanics and Materials 110, 1841-1848, 2012 | | 2012 |