| Gain enhancement of BiCMOS on-chip sub-THz antennas by mean of meta-cells M Stocchi, Z Cao, CH Joseph, T Voss, D Mencarelli, L Pierantoni, ... Scientific Reports 12 (1), 3946, 2022 | 11 | 2022 |
| Optimization of nanoparticle focusing by coupling thermophoresis and engineered vortex in a microfluidic channel C Zhao, Z Cao, J Fraser, A Oztekin, X Cheng Journal of Applied Physics 121 (2), 2017 | 9 | 2017 |
| Bendable 190-GHz transmitter on 20-μm ultra-thin SiGe BiCMOS C Hoyer, L Steinweg, Z Cao, V Rieß, L Li, F Protze, C Carta, J Wagner, ... IEEE Journal on Flexible Electronics 1 (2), 122-133, 2022 | 5 | 2022 |
| An advanced finite element model for BiCMOS process oriented ultra-thin wafer deformation Z Cao, A Göritz, M Stocchi, M Wietstruck, C Hoyer, LD Steinweg, C Carta, ... IEEE Transactions on Semiconductor Manufacturing 35 (1), 2-10, 2021 | 5 | 2021 |
| Automated extraction of silicon dioxide thermal conductivity values based on electro-thermal simulations A Datsuk, F Korndörfer, M Kaynak, Z Cao, K Dhawan, V Timochenkov 2019 IEEE Conference of Russian Young Researchers in Electrical and …, 2019 | 3 | 2019 |
| D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps Z Cao, M Stocchi, C Wipf, J Lehmann, L Li, ST Wipf, M Wietstruck, C Carta, ... 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | 2 | 2023 |
| Characterization and optimization of the heat dissipation capability of a chip-on-board package using finite element methods Z Cao, M Stocchi, M Wietstruck, T Mausolf, C Carta, M Kaynak IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 2 | 2023 |
| Towards a fully integrated sub-THz microfluidic sensor platform for dielectric spectroscopy C Heine, EC Durmaz, D Wang, Z Cao, M Wietstruck, B Tillack, D Kissinger Frequenz 76 (11-12), 685-697, 2022 | 2 | 2022 |
| BiCMOS integrated temperature sensor for thermal evaluation of fan-out wafer-level packaging (FOWLP) including hot spot analysis M Wietstruck, T Mausolf, J Lehmann, Z Cao, TD Nguyen, M Wöhrmann, ... 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 1-5, 2022 | 2 | 2022 |
| Label-free focusing of viral particles under a temperature gradient coupled with continuous swirling flow D Luo, C Zhao, G Xue, Z Cao, A Oztekin, X Cheng RSC advances 12 (7), 4263-4275, 2022 | 2 | 2022 |
| High Frequency Magnetic Sheet Materials – Performance Factor Comparisons and Design of Toroidal Inductors Embedded in PCB R Murphy, P McCloskey, Z Cao, C O Mathuna, S O’Driscoll IEEE Applied Power Electronics Conference and Exposition, 2021 | 2 | 2021 |
| Mixed-signal high-voltage CMOS control circuit for RF MEMS varactors MJ Asadi, R Jin, Z Cao, G Ding, V Gholizadeh, HF Nied, JCM Hwang, ... 2018 IEEE International Conference on Integrated Circuits, Technologies and …, 2018 | 2 | 2018 |
| SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications EC Durmaz, C Heine, Z Cao, J Lehmann, D Kissinger, M Wietstruck 2023 IEEE International 3D Systems Integration Conference (3DIC), 01-04, 2023 | 1 | 2023 |
| An advanced finite element model of the Cu pillar solder reflow assembly C Zhibo, P Baran, O Aslihan, H Bruno, C Corrado, K Mehmet 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 1 | 2023 |
| An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package Z Cao, B Heusdens, A Ziaei, M Kaynak 2022 17th European Microwave Integrated Circuits Conference (EuMIC), 185-188, 2022 | 1 | 2022 |
| Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding M Stocchi, M Wietstruck, S Schulze, C Zhibo, S Tolunay, M Kaynak 2020 IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2020 | 1 | 2020 |
| Finite-element modelling of stress induced wafer warpage for a full BiCMOS process Z Cao, A Göritz, M Wietstruck, ST Wipf, A Trusch, M Kaynak 2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2019 | 1 | 2019 |
| The Assembly Investigation of a Multi-chip to PCB Flip-chip Package Using Cu Pillar Bumps Z Cao, J Lehmann, B Heusdens, EC Durmaz, P Krüger, M Wietstruck, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Advancements in the Cu Pillar Based PCB Microfluidic System Integration with SiGe BiCMOS Technology EC Durmaz, C Heine, Z Cao, D Kissinger, M Wietstruck 2024 Smart Systems Integration Conference and Exhibition (SSI), 1-4, 2024 | | 2024 |
| The Chip-Level in-Plane Stress Distribution over BiCMOS Wafers Z Cao, T Voss, M Wietstruck, C Carta, M Kaynak 2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2024 | | 2024 |
