| Plastic deformation behavior and processing maps of a Ni-based superalloy P Zhang, C Hu, C Ding, Q Zhu, H Qin Materials & Design (1980-2015) 65, 575-584, 2015 | 100 | 2015 |
| Hot compression deformation and constitutive modeling of GH4698 alloy P Zhang, C Hu, Q Zhu, C Ding, H Qin Materials & Design (1980-2015) 65, 1153-1160, 2015 | 76 | 2015 |
| Sustainable fabrication of Cu/Nb composites with continuous laminated structure to achieve ultrahigh strength and excellent electrical conductivity C Ding, J Xu, D Shan, B Guo, TG Langdon Composites Part B: Engineering 211, 108662, 2021 | 48 | 2021 |
| Poly (vinyl alcohol) hydrogels integrated with cuprous oxide–tannic acid submicroparticles for enhanced mechanical properties and synergetic antibiofouling X Lin, X Huang, C Zeng, W Wang, C Ding, J Xu, Q He, B Guo Journal of colloid and interface science 535, 491-498, 2019 | 40 | 2019 |
| Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding C Ding, J Xu, X Li, D Shan, B Guo, TG Langdon Advanced Engineering Materials 22 (1), 1900702, 2020 | 34 | 2020 |
| Electroplasticity in the Al0. 6CoCrFeNiMn high entropy alloy subjected to electrically-assisted uniaxial tension Z Yang, J Bao, C Ding, S Son, Z Ning, J Xu, D Shan, B Guo, HS Kim Journal of Materials Science & Technology 148, 209-221, 2023 | 15 | 2023 |
| The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites C Ding, J Xu, D Shan, B Guo, TG Langdon Journal of Materials Science & Technology 157, 163-173, 2023 | 9 | 2023 |
| Fracture mechanism of electrically-assisted micro-tension in nanostructured titanium using synchrotron radiation X-ray tomography W Chen, J Xu, C Ding, D Shan, B Guo, TG Langdon Scripta Materialia 222, 114997, 2023 | 6 | 2023 |
| In situ TEM observations of thickness effect on grain growth in pure titanium thin films C Ding, W Chen, S Sabbaghianrad, J Xu, D Shan, B Guo, TG Langdon Materials Characterization 173, 110929, 2021 | 6 | 2021 |
| Fabricating flexible wafer-size inorganic semiconductor devices Y Yuan, S Xie, C Ding, X Shi, J Xu, K Li, W Zhao Journal of Materials Chemistry C 8 (6), 1915-1922, 2020 | 6 | 2020 |
| Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper J Li, C Ding, W Chen, D Shan, B Guo, J Xu Materials & Design 229, 111873, 2023 | 5 | 2023 |
| Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites C Ding, J Xu, D Shan, B Guo, TG Langdon Heliyon 9 (5), 2023 | 3 | 2023 |
| Characterization of stress drop and strain localization for titanium alloy subjected to electrically-assisted tension J Bao, C Ding, J Xu, Z Yang, D Shan, B Guo Journal of Materials Research and Technology 28, 4600-4614, 2024 | 2 | 2024 |
| Effects of current density on the mechanical properties and microstructures of CoCrFeNiMn high-entropy alloy Z Yang, S Son, C Ding, J Xu, D Shan, B Guo, HS Kim Journal of Materials Research and Technology 29, 1630-1641, 2024 | 1 | 2024 |
| Microhardness and Microstructural Evolution of Pure Nickel Processed by High-Pressure Torsion M Sun, C Ding, J Xu, D Shan, B Guo, TG Langdon Crystals 13 (6), 887, 2023 | 1 | 2023 |
| A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance H Jiang, X Wang, C Ding, D Shan, B Guo, H Qi, J Xu International Journal of Heat and Mass Transfer 231, 125814, 2024 | | 2024 |
| Multiresponse Liquid Metal Bionic Flexible Actuator X Lv, H Tao, X Yuan, Z Wang, C Ding, J Xu, D Shan, B Guo Langmuir, 2024 | | 2024 |
| Microstructure Evolution and Mechanical Properties of AlCoCrFeNi2.1 Eutectic High-Entropy Alloys Processed by High-Pressure Torsion F Wang, C Ding, Z Yang, H Zhang, Z Ding, H Li, J Xu, D Shan, B Guo Materials 17 (12), 2954, 2024 | | 2024 |
