| DAB converter for EV onboard chargers using bare-die SiC MOSFETs and leakage-integrated planar transformer Y Park, S Chakraborty, A Khaligh IEEE Transactions on Transportation Electrification 8 (1), 209-224, 2021 | 67 | 2021 |
| Potential cybersecurity issues of fast charging stations with quantitative severity analysis Y Park, OC Onar, B Ozpineci 2019 IEEE CyberPELS (CyberPELS), 1-7, 2019 | 21 | 2019 |
| A bare-die SiC-based isolated bidirectional DC-DC converter for electric vehicle on-board chargers Y Park, S Chakraborty, A Khaligh 2020 IEEE Transportation Electrification Conference & Expo (ITEC), 49-54, 2020 | 16 | 2020 |
| Advanced packaging and thermal management of high-power DC-DC converters SU Yuruker, RK Mandel, P McCluskey, MM Ohadi, S Chakraborty, Y Park, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 13 | 2019 |
| Electro-thermal co-design of a cooling system-integrated high-frequency transformer Y Park, S Yuruker, S Chakraborty, A Khaligh, R Mandel, P McCluskey, ... 2020 IEEE Transportation Electrification Conference & Expo (ITEC), 26-31, 2020 | 9 | 2020 |
| On-chip hybrid regulator topology for portable SoCs with near-threshold operation Y Park, E Salman 2016 IEEE International Symposium on Circuits and Systems (ISCAS), 786-789, 2016 | 9 | 2016 |
| Characterization of a bare-die SiC-based, wirebond-less, integrated half-bridge with multi-functional bus-bars Y Park, S Chakraborty, A Khaligh IEEE Transactions on Transportation Electrification 8 (3), 3946-3959, 2022 | 4 | 2022 |
| Thermo-mechanical design considerations in 3D-integrated SiC power device package FP McCluskey, H Yun, CE Buxbaum, S Yuruker, R Mandel, M Ohadi, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 4 | 2020 |
| High Efficiency Fully Integrated On-Chip Regulator for Wide-Range Output Current Y Park, E Salman 2020 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2020 | 2 | 2020 |
| Modular power electronics converters with enhanced connectivity reliability and simplified method of fabrication P Yongwan, S Chakraborty, A Khaligh US Patent 11,895,775, 2024 | 1 | 2024 |
| Monolithic half-bridge die S Chakraborty, P Yongwan, A Khaligh US Patent App. 17/741,086, 2023 | | 2023 |
| Input DC-link Capacitor Design and Thermal Considerations for a Voltage Source Inverter Using the Approach of Switching Functions AS Gamwari, C Singhabahu, R Resalayyan, Y Park, A Khaligh 2022 IEEE 31st International Symposium on Industrial Electronics (ISIE), 558-563, 2022 | | 2022 |
| A BARE-DIE SIC-BASED ELECTRO-THERMALLY CO-DESIGNED WIRE-BONDLESS HIGH-FREQUENCY DC-DC CONVERTER Y Park | | 2021 |
| Fully Integrated Hybrid Voltage Regulator for Low Voltage Applications Y Park State University of New York at Stony Brook, 2016 | | 2016 |
