| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 43 | 2022 |
| High-cycle fatigue properties of curved-surface AlSi10Mg parts fabricated by powder bed fusion additive manufacturing Y Zhou, EM Abbara, D Jiang, A Azizi, MD Poliks, F Ning Rapid Prototyping Journal 28 (7), 1346-1360, 2022 | 25 | 2022 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 11 | 2022 |
| Printed stretchable conductors for smart clothing: the effect of conductor geometry and substrate properties on electromechanical behaviors KUS Somarathna, GS Khinda, B Garakani, EM Abbara, N Stoffel, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 500-506, 2021 | 11 | 2021 |
| Development of next generation stretchable materials for flexible hybrid electronics (FHE) SM Ramkumar, A Stemmermann, BM Rajan, I Quelhas, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 829-834, 2020 | 11 | 2020 |
| Electromechanical characterization of a highly stretchable liquid metal derived conductor for wearable electronics B Garakani, KUS Somarathna, GS Khinda, RS Sivasubramony, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 762-768, 2021 | 10 | 2021 |
| A comparative study of aerosol jet printing on polyimide and liquid crystal polymer substrates for RF applications M Alhendi, A Umar, EM Abbara, R Cadwell, N Huang, DL Weerawarne, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1579-1585, 2020 | 7 | 2020 |
| Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing R Al-Haidari, M Alhendi, D Richmond, EM Abbara, A Obeidat, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 668-675, 2023 | 6 | 2023 |
| Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate EM Abbara, GS Khinda, M Alhendi, R Alhaidari, F Alshatnawi, B Garakani, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 794-800, 2022 | 6 | 2022 |
| Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications F Alshatnawi, M Alhendi, EM Abbara, R Sivasubramony, B Garakani, ... Advanced Engineering Materials 25 (20), 2300439, 2023 | 4 | 2023 |
| 5G-enabled, battery-less smart skins for self-monitoring megastructures and digital twin applications C Lynch, A Adeyeye, EM Abbara, A Umar, M Alhendi, C Minnella, ... Scientific Reports 14 (1), 10002, 2024 | 3 | 2024 |
| Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications EM Abbara, M Alhendi, R Al-haidari, N Gee, MD Poliks, E Boggs, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 426-431, 2023 | 3 | 2023 |
| Investigation of electromechanical reliability and radio frequency performance of a highly stretchable liquid metal conductor for wearable electronics B Garakani, US Somarathna, A Umar, GS Khinda, MYM Abdelatty, ... Journal of Electronic Packaging 145 (3), 031006, 2023 | 2 | 2023 |
| 3D printing of poly (ethylene oxide) or electrospun polystyrene microtube embedded sodium alginate and carboxymethyl cellulose hydrogel Y Chen, Y Zhou, EM Abbara, M Alhendi, M Poliks, F Ning, Y Zhou Manufacturing Letters 35, 194-201, 2023 | 1 | 2023 |
| SiC Power Module Packaging Using Printed Electronics Materials and Processes R Al-Haidari, D Richmond, A Obeidat, M Alhendi, EM Abbara, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Electrical Behavior of Thin Die Assembly on Flexible Substrate Under Vibration Testing S Lieberman, EM Abbara, N Gee, KUS Somarathna, B Falola, A Navkar, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1670-1676, 2024 | | 2024 |
| Etude du compotement thermique des locaux conditionnés et non conditionnés E ABBARA | | 2016 |
| Thermal behavior of a partition wall with phase change material between local non conditioned and different locals conditioned EM Abbara, H Friha, J Lahjomri, A Oubarra 2015 3rd International Renewable and Sustainable Energy Conference (IRSEC), 1-3, 2015 | | 2015 |
| 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)| 979-8-3503-3498-2/23/$31.00© 2023 IEEE| DOI: 10.1109/ECTC51909. 2023.00390 EM Abbara, A Afripin, RS Aga, R Aga, A Ahari, KC Ahn, H Aizawa, ... | | |
