| Chemical mechanical planarization: slurry chemistry, materials, and mechanisms M Krishnan, JW Nalaskowski, LM Cook Chemical reviews 110 (1), 178-204, 2010 | 535 | 2010 |
| Dual etch stop/diffusion barrier for damascene interconnects DC Edelstein, TJ Dalton, JG Gaudiello, M Krishnan, SG Malhotra, ... US Patent 6,153,935, 2000 | 330 | 2000 |
| Metal-gate FinFET and fully-depleted SOI devices using total gate silicidation J Kedzierski, E Nowak, T Kanarsky, Y Zhang, D Boyd, R Carruthers, ... Digest. International Electron Devices Meeting,, 247-250, 2002 | 281 | 2002 |
| Very low effective dielectric constant interconnect structures and methods for fabricating the same DF Canaperi, TJ Dalton, SM Gates, M Krishnan, SV Nitta, ... US Patent 7,045,453, 2006 | 260 | 2006 |
| Prehospital transdermal glyceryl trinitrate in patients with ultra-acute presumed stroke (RIGHT-2): an ambulance-based, randomised, sham-controlled, blinded, phase 3 trial PM Bath, P Scutt, CS Anderson, JP Appleton, E Berge, L Cala, M Dixon, ... The Lancet 393 (10175), 1009-1020, 2019 | 166 | 2019 |
| Integrated chemical systems: photocatalysis at semiconductors incorporated into polymer (Nafion)/mediator systems M Krishnan, JR White, MA Fox, AJ Bard Journal of the American Chemical Society 105 (23), 7002-7003, 1983 | 164 | 1983 |
| Copper recess process with application to selective capping and electroless plating ST Chen, TJ Dalton, KM Davis, CK Hu, FF Jamin, SK Kaldor, M Krishnan, ... US Patent 6,975,032, 2005 | 154 | 2005 |
| IEDM Tech J Kedzierski, DM Fried, EJ Nowak, T Kanarsky, JH Rankin, H Hanafi, ... Dig 247 (441), 2003, 2002 | 112 | 2002 |
| Selective capping of copper wiring PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ... US Patent 7,008,871, 2006 | 104 | 2006 |
| Detailed dynamics of electron beams self-trapped and accelerated in a self-modulated laser wakefield SY Chen, M Krishnan, A Maksimchuk, R Wagner, D Umstadter Physics of Plasmas 6 (12), 4739-4749, 1999 | 96 | 1999 |
| Slurry for mechanical polishing (CMP) of metals and use thereof DF Canaperi, WJ Cote, P Feeney, M Krishnan, JC Liu, MF Lofaro, ... US Patent 6,348,076, 2002 | 95 | 2002 |
| Towards large size substrates for III-V co-integration made by direct wafer bonding on Si N Daix, E Uccelli, L Czornomaz, D Caimi, C Rossel, M Sousa, H Siegwart, ... APL materials 2 (8), 2014 | 90 | 2014 |
| Method of forming barrier layers for damascene interconnects DC Edelstein, TJ Dalton, JG Gaudiello, M Krishnan, SG Malhotra, ... US Patent 6,358,832, 2002 | 80 | 2002 |
| pH-buffered slurry and use thereof for polishing CK Huynh, M Krishnan, MJ MacDonald, MP Murray US Patent 6,190,237, 2001 | 76 | 2001 |
| Polymer films on electrodes. 14. Spectral sensitization of n-type tin (IV) oxide and voltammetry at electrodes modified with Nafion films containing Ru (bpy) 32+ M Krishnan, X Zhang, AJ Bard Journal of the American Chemical Society 106 (24), 7371-7380, 1984 | 76 | 1984 |
| Effects of overlayers on electromigration reliability improvement for cu/low k interconnects CK Hu, D Canaperi, ST Chen, LM Gignac, B Herbst, S Kaldor, M Krishnan, ... 2004 IEEE International Reliability Physics Symposium. Proceedings, 222-228, 2004 | 75 | 2004 |
| Electroless plating of copper at a low pH level R Jagannathan, M Krishnan IBM Journal of Research and Development 37 (2), 117-124, 1993 | 67 | 1993 |
| A high performance 0.13/spl mu/m copper BEOL technology with low-k dielectric RD Goldblatt, B Agarwala, MB Anand, EP Barth, GA Biery, ZG Chen, ... Proceedings of the IEEE 2000 International Interconnect Technology …, 2000 | 66 | 2000 |
| Method and process for forming a self-aligned silicide contact C Cabral Jr, MA Cobb, A Frye, BSP Haran, RF Knarr, M Krishnan, ... US Patent 7,544,610, 2009 | 57 | 2009 |
| Immunodominant peptide epitopes of allergen, Asp f 1 from the fungus Aspergillus fumigatus VP Kurup, B Banerjee, PS Murali, PA Greenberger, M Krishnan, V Hari, ... Peptides 19 (9), 1469-1477, 1998 | 57 | 1998 |
