| Fatigue life of joint-scale SAC305 solder specimens in tensile and shear mode A Deshpande, Q Jiang, A Dasgupta, U Becker 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 28 | 2019 |
| Global-local finite element optimization study to minimize BGA damage under thermal cycling A Deshpande, H Khan, F Mirza, D Agonafer Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 26 | 2014 |
| Multi-scale crystal viscoplasticity approach for estimating anisotropic steady-state creep properties of single-crystal SnAgCu alloys Q Jiang, A Deshpande, A Dasgupta International Journal of Plasticity 153, 103271, 2022 | 23 | 2022 |
| Elastic behavior of coarse-grained SnAgCu (SAC) solder joints based on an anisotropic multi-scale predictive modeling approach Q Jiang, A Deshpande, A Dasgupta Journal of Electronic Materials 48, 8076-8088, 2019 | 22 | 2019 |
| Effect of stress state on fatigue characterization of SAC305 solder joints A Deshpande, H Kaeser, A Dasgupta 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 17 | 2019 |
| Role of nominal stress state on cyclic fatigue durability of SAC305 grain-scale solder joints A Deshpande, Q Jiang, A Dasgupta, U Becker Journal of Electronic Packaging 144 (3), 031006, 2022 | 15 | 2022 |
| A joint-scale test specimen for tensile properties of solder alloys A Deshpande, Q Jiang, A Dasgupta 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 14 | 2018 |
| Multi design variable optimization of QFN package on thick boards for enhanced board level reliability S Krishnamurthy, A Deshpande, MM Islam, D Agonafer 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 14 | 2016 |
| Virtual testing and digital twin approaches for response of grain-scale solder interconnects to multiaxial loading T Hauck, M Van Soestbergen, Q Jiang, A Deshpande, A Bharamgonda, ... 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 13 | 2022 |
| Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints Q Jiang, AN Deshpande, A Dasgupta Materials 14 (20), 5973, 2021 | 12 | 2021 |
| Effect of microscale heterogeneities and stress state on the mechanical behavior of solder joints A Deshpande, Q Jiang, A Dasgupta 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 12 | 2020 |
| Grain-scale study of sac305 oligocrystalline solder joints: anisotropic elasto-plastic constitutive properties of single crystals A Deshpande, A Bharamgonda, Q Jiang, A Dasgupta Journal of Electronic Packaging 145 (4), 2023 | 8 | 2023 |
| A Creep Model For Pressure Sensitive Adhesives under Shear Load A Deshpande, Z Song, S Vaidya 2020 Asia-Pacific International Symposium on Advanced Reliability and …, 2020 | 8 | 2020 |
| Copper trace failures in ball grid array (BGA) packages under sequential harmonic vibration and temperature cycling A Deshpande, I Olatunji, M Bascolo, A Dasgupta, U Becker, J Gabor 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 7 | 2022 |
| Effects of anisotropic viscoplasticity on SAC305 solder joint deformation: grain-scale modeling of temperature cycling Q Jiang, A Deshpande, A Dasgupta 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics …, 2021 | 7 | 2021 |
| Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading A Deshpande, Q Jiang, A Dasgupta 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics …, 2021 | 7 | 2021 |
| Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration? Q Jiang, A Deshpande, A Dasgupta International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 7 | 2017 |
| Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly A Bharamgonda, A Dasgupta, A Deshpande, T Hauck, Y Chen 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 6 | 2023 |
| Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling I Olatunji, A Deshpande, M Bascolo, A Dasgupta, U Becker, G Jokai 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 5 | 2022 |
| Vulnerability of copper pad in BGA solder interconnects under Temperature cycling M Loukia, A Deshpande, A Dasgupta 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 5 | 2021 |
Abhijit DasguptaProfessor of Mechanical Engineering, University of Maryland在 umd.edu 的电子邮件经过验证
