| Alcohol-Based Sulfur Treatment for Improved Performance and Yield in Local Back-Gated and Channel-Length-Scaled MoS₂ FETs S Sanjay, K Sahoo, N Bhat IEEE Transactions on Electron Devices 67 (9), 3711-3715, 2020 | 10 | 2020 |
| Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric NS Chase, K Sahoo, YT Yang, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1241-1246, 2020 | 10 | 2020 |
| Complementary metal oxide semiconductor-compatible top-down fabrication of a Ni/NiO nanobeam room temperature hydrogen sensor device KMB Urs, K Sahoo, N Bhat, V Kamble ACS Applied Electronic Materials 4 (1), 87-91, 2022 | 9 | 2022 |
| A high throughput two-stage die-to-wafer thermal compression bonding scheme for heterogeneous integration K Sahoo, H Ren, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 362-366, 2023 | 7 | 2023 |
| Functional demonstration of< 0.4-pJ/bit, 9.8 μm fine-pitch dielet-to-dielet links for advanced packaging using silicon interconnect fabric K Sahoo, U Rathore, SC Jangam, T Nguyen, D Markovic, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2104-2110, 2022 | 5 | 2022 |
| I/o architecture, substrate design, and bonding process for a heterogeneous dielet-assembly based waferscale processor S Pal, I Alam, K Sahoo, H Suhail, R Kumar, S Pamarti, P Gupta, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 298-303, 2021 | 5 | 2021 |
| Flexible connectors and PCB segmentation for signaling and power delivery in wafer-scale systems R Irwin, K Sahoo, S Pal, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 507-513, 2021 | 5 | 2021 |
| Copper to gold thermal compression bonding in heterogenous wafer-scale systems K Sahoo, S Pal, N Shakoorzadeh, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 487-493, 2021 | 5 | 2021 |
| A 16-nm 784-Core Digital Signal Processor Array, Assembled as a 2× 2 Dielet With 10-μm Pitch Interdielet I/O for Runtime Multiprogram Reconfiguration SS Nagi, U Rathore, K Sahoo, T Ling, SS Iyer, D Marković IEEE Journal of Solid-State Circuits 58 (1), 111-123, 2022 | 4 | 2022 |
| Effect of substrate transfer on performance of vertically stacked ultrathin MOS devices PVK Nittala, K Sahoo, N Bhat, KN Bhat, P Sen IEEE Transactions on Electron Devices 66 (3), 1153-1159, 2019 | 3 | 2019 |
| Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems H Ren, K Sahoo, T Xiang, G Ouyang, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1614-1621, 2023 | 2 | 2023 |
| TrueAdaptTM- AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging G Sabbir, K Sahoo, H Sun, S Iyer, G Ouyang, Y Wu 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2240-2246, 2023 | 2 | 2023 |
| A study on warpage and reflow profile for extreme extension of mass reflow bonding J Shin, K Woo, D Kwon, Y Kim, Y Lee, D Kang, K Sahoo, H Ren, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1158-1162, 2022 | 2 | 2022 |
| Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets K Sahoo, V Harish, JH Liu, R Irwin, CTM Yang, H Sun, SS Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1940-1946, 2024 | 1 | 2024 |
| Heterogeneous Power Delivery for Large Chiplet-based Systems using Integrated GaN/Si-Interconnect Fabric with sub-10 μm Bond Pitch H Ren, K Sahoo, Z Guo, R Pugazhendhi, Z Wong, T Xiang, TS Fisher, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 1 | 2023 |
| An On-Chip ESD Sensor for Use in Advanced Packaging KT Kannan, B Vaisband, K Sahoo, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 1 | 2022 |
| Co-optimizing signaling protocol with semiconductor and packaging technology K Sahoo, B Vinnakota, S Ardalan, SS Iyer 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 1 | 2021 |
| Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films V Harish, K Sahoo, K Zheng, G Park, HW Chen, S Verhaverbeke, SS Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2178-2183, 2024 | | 2024 |
| Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding A Kuchhangi, H Ren, K Sahoo, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1633-1637, 2023 | | 2023 |
| Low Actuation Voltage Nano-Electro-Mechanical Switching Device for Ultra-Low Power Applications K Sahoo, P Sen, N Bhat 2018 4th IEEE International Conference on Emerging Electronics (ICEE), 1-4, 2018 | | 2018 |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,在 g.ucla.edu 的电子邮件经过验证
