| Simulation and experimental characterization of microporosity during solidification in Sn-Bi alloys G Siroky, E Kraker, D Kieslinger, E Kozeschnik, W Ecker Materials & Design 212, 110258, 2021 | 9 | 2021 |
| Analysis of Sn-Bi Solders: X-ray micro computed tomography imaging and microstructure characterization in relation to properties and liquid phase healing potential G Siroky, E Kraker, J Rosc, D Kieslinger, R Brunner, S Van Der Zwaag, ... Materials 14 (1), 153, 2020 | 8 | 2020 |
| Micromechanics-based damage model for liquid-assisted healing G Siroky, E Kraker, D Kieslinger, E Kozeschnik, W Ecker International Journal of Damage Mechanics 30 (1), 123-144, 2021 | 7 | 2021 |
| Effect of solder joint size and composition on liquid-assisted healing G Siroky, E Kraker, J Magnien, D Melinc, D Kieslinger, E Kozeschnik, ... Microelectronics Reliability 119, 114066, 2021 | 4 | 2021 |
| Numerical study on local effects of composition and geometry in self-healing solders G Siroky, E Kraker, J Magnien, E Kozeschnik, D Kieslinger, W Ecker 2019 20th international conference on thermal, mechanical and multi-physics …, 2019 | 4 | 2019 |
| Healing solders: A numerical investigation of damage-healing experiments G Siroky, D Melinc, J Magnien, E Kozeschnik, D Kieslinger, E Kraker, ... 2020 21st International conference on thermal, mechanical and multi-physics …, 2020 | 3 | 2020 |
| Modelling of Void Collapse with Molecular Dynamics in Pure Sn G Siroky, E Kraker, D Kieslinger, L Romaner, E Kozeschnik, W Ecker 4th International Conference nanoFIS2020, 2020 | 2 | 2020 |
| TSEP-Sensitivity Study to Analyze the Soldering Process of a Power Diode L Mitterhuber, J Magnien, G Siroky, D Kieslinger, E Kraker 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 2 | 2020 |
| Modelling and experiments of liquid phase healing in solder alloys G Siroky Technische Universität Wien, 2021 | 1 | 2021 |
| Introduction to X-ray microtomography G Siroky Institute for Surgical Technologies and Biomechanics, 1-27, 2018 | 1 | 2018 |
| Non-eutectic sn-bi-in solder alloys DM Dietmar KIESLINGER, Georg Siroky, Jakob Bayer, Julien Magnien EP Patent EP4159359A1, 2023 | | 2023 |
| Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder D Melinc, J Magnien, G Siroky, D Kieslinger, E Kozeschnik 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | | 2020 |
| Lap shear test for solder materials: Local stress states and their effect on deformation and damage G Siroky, J Magnien, D Melinc, E Kozeschnik, D Kieslinger, E Kraker, ... Microelectronics Reliability 109, 113655, 2020 | | 2020 |
| Coupled Atomistic-Continuum Models for Strength Prediction in Fiber-Polymer Composites GSMS Cand, H Baier | | 2016 |
