Method for generating a three-dimensional NAND memory with mono-crystalline channels using sacrificial material Y Roizin, A Strum US Patent 8,501,609, 2013 | 44 | 2013 |
Three-dimensional NAND memory with stacked mono-crystalline channels Y Roizin, A Strum US Patent 8,599,616, 2013 | 36 | 2013 |
Backside illuminated (BSI) complementary metal-oxide-semiconductor (CMOS) image sensors A Lahav, A Fenigstein, A Strum, S Rizzolo High Performance Silicon Imaging, 95-117, 2020 | 24 | 2020 |
Image sensor pixel with memory node having buried channel and diode portions formed on N-type substrate A Lahav, A Fenigstein, Y Roizin, A Strum US Patent 9,865,632, 2018 | 23 | 2018 |
Image sensor pixel with memory node having buried channel and diode portions A Lahav, A Fenigstein, Y Roizin, A Strum US Patent 9,729,810, 2017 | 22 | 2017 |
Monte Carlo simulations of the cross talk in InSb matrices RM Fastow, A Strum Infrared Detectors: State of the Art II 2274, 136-146, 1994 | 22 | 1994 |
High resolution integrated X-ray CMOS image sensor Y Roizin, A Fenigstein, A Strum, A Heiman, D Pardess US Patent 7,608,837, 2009 | 21 | 2009 |
Transition to second-generation HgCdTe FPA Y Juravel, A Strum, A Fenigstein, E Weiss, N Mainzer, N Sapir, I Lokomski, ... Infrared Technology and Applications XXIII 3061, 652-661, 1997 | 16 | 1997 |
High-speed compare operation using magnetic tunnel junction elements including two different anti-ferromagnetic layers Y Roizin, A Strum US Patent 9,330,748, 2016 | 12 | 2016 |
Zero-cost MTP high density NVM modules in a CMOS process flow A Atrash, G Cassuto, W Chen, V Dayan, O Galzur, M Gutman, A Heiman, ... 2010 IEEE International Memory Workshop, 1-4, 2010 | 10 | 2010 |
High-resolution integrated X-ray CMOS image sensor Y Roizin, A Fenigstein, A Strum, A Heiman, D Pardess US Patent 8,501,573, 2013 | 9 | 2013 |
Non-volatile memories in the foundry business A Strum, T Mahlen, Y Roizin 2010 IEEE International Memory Workshop, 1-5, 2010 | 9 | 2010 |
Low-cost embedded NVM for power management designs Y Roizin, E Pikhay, A Fenigstein, A Strum ECN: Electronic Component News, Oct, 2008 | 6 | 2008 |
High Performance Silicon Imaging A Lahav, A Fenigstein, A Strum, S Rizzolo Woodhead Publishing, 2014 | 5 | 2014 |
Complementary metal-oxide-semiconductor (CMOS) X-ray sensors A Strum, A Fenigstein High Performance Silicon Imaging, 348-372, 2014 | 4 | 2014 |
Back-end processing using low-moisture content oxide cap layer A Fenigstein, Y Roizin, A Strum US Patent 9,431,455, 2016 | 2 | 2016 |
Image sensor module and a method for evaluating an image sensor Y Roizin, V Goldovsky, A Strum, Y Davidovich, A Fenigstein, A Lahav, ... US Patent 10,210,526, 2019 | 1 | 2019 |
Image sensor module and a method for evaluating an image sensor V Goldovsky, Y Roizin, A Strum, A Fenigstein, Y Davidovich, A Lahav, ... Optical Sensors 2019 11028, 204-207, 2019 | | 2019 |
Logic unit including magnetic tunnel junction elements having two different anti-ferromagnetic layers Y Roizin, A Strum US Patent 9,331,123, 2016 | | 2016 |
Imager module packaging having top and bottom glass layers A Strum US Patent 7,807,960, 2010 | | 2010 |