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Nithin Vinod Upot, PhD
Nithin Vinod Upot, PhD
Senior IC Packaging Engineer, Intel Corporation
在 intel.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
Scalable and Resilient Etched Metallic Micro- and Nanostructured Surfaces for Enhanced Flow Boiling
NV Upot, A Mahvi, KF Rabbi, J Li, AM Jacobi, N Miljkovic
ACS Applied Nano Materials 4 (7), 6648-6658, 2021
272021
Advances in micro and nanoengineered surfaces for enhancing boiling and condensation heat transfer: a review
NV Upot, KF Rabbi, S Khodakarami, JY Ho, JK Mendizabal, N Miljkovic
Nanoscale Advances, 1232-1270, 2023
252023
Perspectives on superhydrophobic surface durability
MJ Hoque, J Ma, KF Rabbi, X Yan, BP Singh, NV Upot, W Fu, J Kohler, ...
Applied Physics Letters 123 (11), 2023
92023
Enhanced refrigerant flow boiling heat transfer in microstructured finned surfaces
NV Upot, A Bakhshi, KF Rabbi, F Lu, AM Jacobi, N Miljkovic
International Journal of Heat and Mass Transfer 207, 123999, 2023
82023
Etching-enabled ultra-scalable micro and nanosculpturing of metal surfaces for enhanced thermal performance
NV Upot, KF Rabbi, A Bakhshi, JK Mendizabal, N Miljkovic
Applied Physics Letters 122 (3), 031603, 2023
72023
Fazle Rabbi K, Li J, Jacobi AM, Miljkovic N. Scalable and Resilient Etched Metallic Micro-and Nanostructured Surfaces for Enhanced Flow Boiling. ACS Appl Nano Mater 2021; 4 …
NV Upot, A Mahvi
5
Enhanced internal condensation of R1233zd(E) on micro- and nanostructured copper and aluminum surfaces
JK Mendizabal, BP Singh, KF Rabbi, NV Upot, K Nawaz, AM Jacobi, ...
International Journal of Heat and Mass Transfer 207, 124012, 2023
42023
Electro-thermal co-design of a 250 kw silicon carbide traction inverter for heavy equipment applications
Z Wang, Y Zhao, A Mantooth, B Sparkman, J Fraley, MJ Hoque, N Upot, ...
International Exhibition and Conference for Power Electronics, Intelligent …, 2019
42019
Anti-Icing Meter Scale Superhydrophobic Heat Exchangers
KS Boyina, NV Upot, J Mayer, S Chavan, KF Rabbi, T Foulkes, X Wang, ...
6th Micro and Nano Flows Conference, 2018
42018
Saturated water flow boiling heat transfer and pressure drop in scalably microstructured plain and finned copper tubes
MH Mousa, R Rao, CM Yang, MRH Roni, KF Rabbi, NV Upot, V Ganesan, ...
International Journal of Heat and Mass Transfer 222, 125138, 2024
32024
Surface-Modified Component and Method of Achieving High Heat Transfer During Cooling
N Miljkovic, NV Upot, KF Rabbi, AM Jacobi, AJ Mahvi
US Patent App. 17/730,502, 2022
22022
Structured surface enhanced flow boiling
NV Upot
University of Illinois at Urbana-Champaign, 2022
2022
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