Calvin Ling 个人学术档案 - 学术资源搜索

引用次数

	总计	2019 年至今
引用	2	2
h 指数	1	1
i10 指数	0	0

0

2

1

202320241 1

合著作者

Fei Chong NgUniversiti Sains Malaysia在 usm.my 的电子邮件经过验证
Aizat AbasUniversiti Sains Malaysia在 usm.my 的电子邮件经过验证
M. S. Rusdi (Mohd Syakirin Bin Rusdi)Lecturer, Universiti Sains Malaysia在 usm.my 的电子邮件经过验证

Calvin Ling

Calvin Ling

Graduate Researcher, Universiti Sains Malaysia

在 student.usm.my 的电子邮件经过验证 - 首页

Surface Mount Technology Machine Learning


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
Correlation study on voiding in underfill of large quantity ball grid array chip using machine learning C Ling, T Azahari, MA Abas, FC Ng Journal of Electronic Packaging, 1-15, 2025	1	2025
The Comparison of Medical Grade PP with Common Grade PP in Injection Moulding Process MZM Zaki, MS Rusdi, CLT Xiao, NSZ Abidin, MAFM Shafee, A Vimalraj, ... CFD Letters 14 (4), 1-13, 2022	1	2022
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network MT Azahari, C Ling, A Abas, FC Ng Journal of Electronic Packaging 147 (1), 2025		2025
Deep learning and analytical study of void regional formation in flip-chip underfilling process C Ling, MT Azahari, MA Abas, FC Ng Soldering & Surface Mount Technology 36 (1), 60-68, 2024		2024

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