| A novel approach for flip chip solder joint quality inspection: Laser ultrasound and interferometric system S Liu, D Erdahl, IC Ume, A Achari, J Gamalski IEEE transactions on components and packaging technologies 24 (4), 616-624, 2001 | 60 | 2001 |
| Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors-Part I DS Erdahl, IC Ume IEEE transactions on advanced packaging 27 (4), 647-653, 2004 | 40 | 2004 |
| In situ process monitoring for laser-powder bed fusion using convolutional neural networks and infrared tomography H Elwarfalli, D Papazoglou, D Erdahl, A Doll, J Speltz 2019 IEEE National Aerospace and Electronics Conference (NAECON), 323-327, 2019 | 26 | 2019 |
| A novel method and device for solder joint quality inspection by using laser ultrasound S Liu, D Erdahl, C Ume, A Achari 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000 | 24 | 2000 |
| Determination of measurement limit for open solder bumps on a flip-chip package using a laser ultrasonic inspection system DS Erdahl, IC Ume IEEE transactions on advanced packaging 29 (1), 178-185, 2006 | 21 | 2006 |
| Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors-Part II DS Erdahl, IC Ume IEEE transactions on advanced packaging 28 (2), 264-272, 2005 | 19 | 2005 |
| Online-offline laser ultrasonic quality inspection tool for multi-layer chip capacitors DS Erdahl, IC Ume 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 18 | 2002 |
| Development of a flexible laser ultrasonic probe SN Hopko, IC Ume, DS Erdahl J. Manuf. Sci. Eng. 124 (2), 351-357, 2002 | 15 | 2002 |
| Structural modal analysis for detecting open solder bumps on flip chips DS Erdahl, MS Allen, IC Ume, JH Ginsberg IEEE transactions on advanced packaging 31 (1), 118-126, 2008 | 12 | 2008 |
| Development of an advanced system for inspection of flip chip and chip scale packaging interconnects using laser ultrasound and interferometric techniques T Howard, D Erdahl, C Ume, J Galmaski The International Journal of Microcircuits & Electronic Packaging 25 (1), 1-14, 2002 | 11 | 2002 |
| Inspection of flip chip and chip scale package interconnects using laser ultrasound and interferometric techniques T Howard, D Erdahl, IC Ume, J Gamalski, A ACHARI The International journal of microcircuits and electronic packaging 25 (1), 1-14, 2002 | 6 | 2002 |
| Compression and Tensile Testing of L-PBF Ti-6Al-4V Lattice Structures with Biomimetic Porosities and Strut Geometries for Orthopedic Implants DP Papazoglou, AT Neidhard-Doll, MF Pinnell, DS Erdahl, TH Osborn Metals 14 (2), 232, 2024 | 5 | 2024 |
| Development of an advanced system for inspection of flip chip and chip scale package interconnects using laser ultrasound and interferometric techniques T HOWARD, D ERDAHL, IC UME, J GAMALSKI, A ACHARI SPIE proceedings series, 136-142, 2002 | 5 | 2002 |
| Automated material identification and segmentation using deep learning for laser powder bed fusion BN Narayanan, K Beigh, S Duning, D Erdahl Applications of Machine Learning 2020 11511, 137-147, 2020 | 4 | 2020 |
| Empowering students to teach flight dynamics and flight simulation enhanced learning through applied modeling MO Memon, D Erdahl, SR Qureshi 2017 ASEE Annual Conference & Exposition, 2017 | 3 | 2017 |
| Design and implementation of an automated solder joint inspection system DS Erdahl Georgia Institute of Technology, 2000 | 2 | 2000 |
| Microelectronic device inspection system implementation and modeling for flip chips and multi-layer ceramic capacitors DS Erdahl Georgia Institute of Technology, 2005 | 1 | 2005 |
| Design of laser ultrasonic system for in-process weld penetration monitoring and control SN Hopko, IC Ume, DS Erdahl ASME International Mechanical Engineering Congress and Exposition 16462, 659-668, 1999 | 1 | 1999 |
| Laser Ultrasonic Quality Inspection Tool for Crack Detection in Multilayer Ceramic Capacitors D Erdahl, C Ume CARTS-CONFERENCE- 24, 88, 2004 | | 2004 |
| CONTRIBUTIONS FROM THE SEVENTH MECHATRONICS FORUM-A Novel Approach for Flip Chip Solder Joint Quality Inspection: Laser Ultrasound and Interferometric System S Liu, D Erdahl, IC Ume, A Achari IEEE Transactions on Components and Packaging Technology 24 (4), 616-624, 2001 | | 2001 |
Hamed ElwarfalliUniversity of Dayton在 udayton.edu 的电子邮件经过验证
