| Detailed study on MOCVD of wafer-scale MoS2 monolayers: From nucleation to coalescence S Tang, A Grundmann, H Fiadziushkin, A Ghiami, M Heuken, A Vescan, ... Mrs Advances 7 (30), 751-756, 2022 | 12 | 2022 |
| Nucleation and coalescence of tungsten disulfide layers grown by metalorganic chemical vapor deposition H Tang, S Pasko, S Krotkus, T Anders, C Wockel, J Mischke, X Wang, ... Journal of Crystal Growth 608, 127111, 2023 | 8 | 2023 |
| TiN nanobridge Josephson junctions and nanoSQUIDs on SiN-buffered Si MI Faley, H Fiadziushkin, B Frohn, P Schüffelgen, RE Dunin-Borkowski Superconductor Science and Technology 35 (6), 065001, 2022 | 8 | 2022 |
| Migration-Enhanced Metal–Organic Chemical Vapor Deposition of Wafer-Scale Fully Coalesced WS2 and WSe2 Monolayers S Tang, A Grundmann, H Fiadziushkin, Z Wang, S Hoffmann-Eifert, ... Crystal Growth & Design 23 (3), 1547-1558, 2023 | 5 | 2023 |
| Impact of Carbon Impurities on Air Stability of MOCVD 2D-MoS2 A Ghiami, A Grundmann, S Tang, H Fiadziushkin, Z Wang, S Aussen, ... Surfaces 6 (4), 351-363, 2023 | 2 | 2023 |
| Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC A Ghiami, T Sun, H Fiadziushkin, S Tang, A Grundmann, M Heuken, ... Crystals 13 (10), 1474, 2023 | 1 | 2023 |
| Dry Transfer Based on PMMA and Thermal Release Tape for Heterogeneous Integration of 2D-TMDC Layers A Ghiami, H Fiadziushkin, T Sun, S Tang, Y Wang, E Mayer, ... arXiv preprint arXiv:2412.02407, 2024 | | 2024 |
| Reliable and Scalable Integration of 2D-TMDC using a Dry Transfer Technique: A Case Study with 2D-WSe2 Field-Effect Transistors A Ghiami, H Fiadziushkin, S Tang, Y Wang, T Sun, L Patterer, J Schneider, ... | | |
Andrei VescanRWTH Aachen在 cst.rwth-aachen.de 的电子邮件经过验证
