| Process Recipes of Additively Printed Sustainable Silver-Ink Using Aerosol Jet Printing P Lall, S Bimali, V Soni, S Miller 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 14 | 2023 |
| Realization of Circuits with Additively Printed Water Based Nanoparticle Sustainable Silver-Ink with Ultrasonic Atomization on Aerosol Jet Printer P Lall, D Karakitie, V Soni, S Miller 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 12 | 2023 |
| Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying Charge Protocols and C-Rates P Lall, V Soni, A Abrol, B Leever, S Miller 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 10 | 2019 |
| Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology P Lall, V Soni, C Hill 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 9 | 2021 |
| Sintering process conditions for additive printing of multi-layer circuitry aerosol-jet process in conjunction with nanoparticle ink P Lall, J Narangaparambil, V Soni, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 9 | 2020 |
| Capacity degradation of flexible li-ion power sources subjected to shallow discharging P Lall, A Abrol, V Soni, B Leever, S Miller 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 8 | 2019 |
| Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources P Lall, V Soni, A Abrol, B Leever, S Miller International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 7 | 2019 |
| Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform P Lall, S Kulkarni, V Soni, K Goyal, S Miller International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 5 | 2022 |
| Effect of High and Low Storage Temperatures, Storage Duration and Varying Depth of Discharge on Coin Cell SOH Degradation P Lall, V Soni, G Sethi, K Yiang 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 5 | 2022 |
| SOH modelling of Li-ion coin cells subjected to varying C-rates, depths of charge, operating temperatures and custom charge profiles P Lall, V Soni, G Sethi, K Yiang 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 5 | 2021 |
| Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates P Lall, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 4 | 2020 |
| Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits P Lall, V Soni, J Narangaparambil, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 3 | 2023 |
| Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics P Lall, MG Sarwar, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 3 | 2023 |
| Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique P Lall, MG Sarwar, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 3 | 2023 |
| Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques P Lall, F Musa, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 2 | 2023 |
| Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability P Lall, V Soni, S Miller International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 2 | 2023 |
| Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment P Lall, J Narangaparambil, V Soni, S Kulkarni, K Goyal, S Miller 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 404-411, 2023 | 2 | 2023 |
| Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates P Lall, V Soni, J Narangaparambil, K Schulze, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
| Effect of dynamic folding with varying fold orientations and C-rates on flexible power source capacity degradation P Lall, V Soni, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
| Development and performance evaluation of additively printed in-mold-electronic sensors P Lall, V Soni, S Miller 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | 1 | 2024 |
