| Magnetic dynamics of NiPS AR Wildes, JR Stewart, MD Le, RA Ewings, KC Ruke, G Deng, K Anand Physical Review B 106 (17), 2022 | 43 | 2022 |
| Fabrication of cost-effective and efficient paper-based device for viscosity measurement A Rayaprolu, SK Srivastava, K Anand, L Bhati, A Asthana, CM Rao Analytica Chimica Acta 1044, 86-92, 2018 | 29 | 2018 |
| Lattice Deformation at Submicron Scale: X-ray Nanobeam Measurements of Elastic Strain in Electron Shuttling Devices C Corley-Wiciak, MH Zoellner, I Zaitsev, K Anand, E Zatterin, Y Yamamoto, ... Physical Review Applied 20 (2), 2023 | 6 | 2023 |
| Lateral Selective SiGe Growth for Dislocation-Free Virtual Substrate Fabrication K Anand, MA Schubert, AA Corley-Wiciak, D Spirito, C Corley-Wiciak, ... ECS Transactions 109 (4), 269, 2022 | 3 | 2022 |
| Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics … K Anand, P Steglich, J Kreissl, CA Chavarin, D Spirito, M Franck, G Lecci, ... Thin Solid Films, 140399, 2024 | 1 | 2024 |
| Towards Heterogeneous Integration of InP on Si via Micro Transfer Printing by direct adhesion K Anand, P Steglich, J Kreissl, L Zimmermann, A Mai MikroSystemTechnik Kongress 2023; Kongress, Dresden, Deutschland, 2023, 430-435, 2023 | | 2023 |
| Lateral Selective SiGe Growth for Local Dislocation-Free SiGe-on-Insulator Virtual Substrate Fabrication K Anand, MA Schubert, AA Corley-Wiciak, D Spirito, C Corley-Wiciak, ... ECS Journal of Solid State Science and Technology, 2023 | | 2023 |
| (G03 - Best Student Presentation Award) Lateral Selective SiGe Growth for Dislocation-Free Virtual Substrate Fabrication K Anand, MA Schubert, AA Corley-Wiciak, D Spirito, C Corley-Wiciak, ... Electrochemical Society Meeting Abstracts 242, 1218-1218, 2022 | | 2022 |
| Quantitative strain mapping in Si0.7Ge0.3 / Si /Si0.7Ge0.3 heterostructures for spin qubits C Corley-Wiciak, C Richter, W Klesse, E Zatterin, T Schuelli, ... APS March Meeting Abstracts 2022, D39. 010, 2022 | | 2022 |
Yuji YamamotoIHP在 ihp-microelectronics.com 的电子邮件经过验证
