| Soft error mitigation using transmission gate with varying gate and body bias S Sayil, AH Shah, MA Zaman, MA Islam IEEE Design & Test 34 (1), 47-56, 2015 | 29 | 2015 |
| Face-to-face cable interconnect scheme for thin flexible superconducting stripline cables B Yelamanchili, A Shah, SE Peek, V Gupta, JA Sellers, DB Tuckerman, ... IEEE Transactions on Applied Superconductivity 32 (4), 1-5, 2022 | 6 | 2022 |
| Superconducting molybdenum multi-chip module approach for cryogenic and quantum applications A Shah, SE Peek, B Yelamanchili, V Gupta, DB Tuckerman, C Cantaloube, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 276-282, 2022 | 5 | 2022 |
| Towards cable-to-cable connectors for flexible thin-film superconducting transmission lines A Shah, V Gupta, B Yelamanchili, SE Peek, MFF Chowdhury, AS Rashid, ... IEEE Transactions on Applied Superconductivity 31 (5), 1-6, 2021 | 5 | 2021 |
| Reliability characterization of a flexible interconnect for cryogenic and quantum applications ER Schmidgall, F Griggio, GH Thiel, SE Peek, B Yelamanchili, A Shah, ... 2021 IEEE International Reliability Physics Symposium (IRPS), 1-7, 2021 | 4 | 2021 |
| Superconducting microwave interconnect technologies for quantum and cryogenic systems MC Hamilton, B Yelamanchili, A Shah, SE Peek, S Bankson, CC Tillman 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 72-75, 2022 | 3 | 2022 |
| Copper encapsulated ultra-thin nbn films and damascene structures on 300 mm si wafers S Kar, H Walker, A Shah, H Frost, S Olson, J Mucci, J Nalaskowski, ... IEEE Transactions on Applied Superconductivity 33 (5), 1-5, 2023 | 2 | 2023 |
| Increasing Chip-to-Substrate Spacing Using in Capped SnPb Pillars as Flip Chip Interconnects for Physical Isolation in Superconducting Applications GD Hughes, SE Peek, A Shah, MC Hamilton, ML Adams IEEE Transactions on Applied Superconductivity, 2024 | 1 | 2024 |
| Additive manufacturing and characterization of microstructures using two-photon polymerization for use in cryogenic applications SE Peek, J Ward, S Bankson, A Shah, JA Sellers, ML Adams, ... Journal of Materials Research 37 (12), 1978-1985, 2022 | 1 | 2022 |
| Approaches for high performance and thermally optimized flexible cryogenic microwave ribbon cables SE Peek, A Shah, B Yelamanchili, V Gupta, JA Sellers, DB Tuckerman, ... IOP Conference Series: Materials Science and Engineering 1241 (1), 012027, 2022 | 1 | 2022 |
| DC-biased Suzuki stack circuit for Josephson-CMOS memory applications Y Mustafa, K Krause, A Shah, MC Hamilton, S Köse Superconductor Science and Technology 37 (8), 085023, 2024 | | 2024 |
| Tailored Multi-mode, High-Q Superconducting Nb Resonators: Unique Platform for Magnon-Photon Coupling M Mahdi, B Yelamanchili, A Shah, SE Peek, Y Xiong, A Christy, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2244-2249, 2024 | | 2024 |
| Transport Properties of NbN-Cu Bilayer Superconducting Nanowires A Shah, S Kar, CC Tillman, S Bankson, H Frost, E Bhatia, S Olson, ... IEEE Transactions on Applied Superconductivity, 2024 | | 2024 |
| Influence of Laser Processing Proximity on Superconducting Film Performance SE Peek, A Shah, G Gleason, J Ward, ML Adams, MC Hamilton IEEE Transactions on Applied Superconductivity 33 (5), 1-5, 2023 | | 2023 |
