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Abdelhafid ZEHRI
Abdelhafid ZEHRI
PhD student
在 chalmers.se 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials 7 (1), 012001, 2020
2202020
Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
X Long, Z Li, X Lu, H Guo, C Chang, Q Zhang, A Zehri, W Ke, Y Yao, L Ye, ...
Materials Science and Engineering: A 744, 406-414, 2019
552019
High porosity and light weight graphene foam heat sink and phase change material container for thermal management
A Zehri, MK Samani, MG Latorre, A Nylander, T Nilsson, Y Fu, N Wang, ...
Nanotechnology 31 (42), 424003, 2020
252020
Improved interfacial bonding strength and reliability of functionalized graphene oxide for cement reinforcement applications
N Wang, S Wang, L Tang, L Ye, B Cullbrand, A Zehri, BE Tebikachew, ...
Chemistry–A European Journal 26 (29), 6561-6568, 2020
192020
Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
Y Liu, C Xia, A Zehri, L Ye, N Wang, B Zhmud, H Lu, J Liu
Coatings 9 (11), 754, 2019
182019
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ...
Soldering & Surface Mount Technology 31 (4), 193-202, 2019
162019
Surface analysis of iron and steel nanopowder
SK Manchili, R Shvab, A Zehri, L Ye, E Hryha, J Liu, L Nyborg
Surface and Interface Analysis 50 (11), 1083-1088, 2018
112018
Effect of nanopowder addition on the sintering of water-atomized iron powder
SK Manchili, J Wendel, A Zehri, J Liu, E Hryha, L Nyborg
Metallurgical and Materials Transactions A 51, 4890-4901, 2020
102020
Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
S Chen, A Zehri, Q Wang, G Yuan, X Liu, N Wang, J Liu
ChemistryOpen 8 (1), 58-63, 2019
102019
Toward ultrahigh thermal conductivity graphene films
S Guo, S Chen, A Nkansah, A Zehri, M Murugesan, Y Zhang, Y Zhang, ...
2D Materials 10 (1), 014002, 2022
92022
Bin
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
Wang Q, Li M, Lu H, Sledzinska M, Torres CMSS, Volz S, Balandin AA, Xu X and …, 2020
92020
The influence of sintering process on thermal properties of nano-silver paste
X Lu, W Ke, C Zhou, Y Wu, Q Zhang, S Huang, W Xia, L Ye, A Zehri, J Liu
2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018
82018
Graphene oxide and nitrogen-doped graphene coated copper nanoparticles in water-based nanofluids for thermal management in electronics
A Zehri, A Nylander, TMJ Nilsson, L Ye, Y Fu, J Liu
Journal of Nanofluids 11 (1), 125-134, 2022
62022
Multiple growth of graphene from a pre-dissolved carbon source
A Fazi, A Nylander, A Zehri, J Sun, P Malmberg, L Ye, J Liu, Y Fu
Nanotechnology 31 (34), 345601, 2020
62020
2D Materials Graphene related materials for thermal management Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials, 2019
32019
Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid
AH Zehri, A Nylander, L Ye, J Liu
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
22019
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Y Liu, N Wang, L Ye, A Zehri, A Nylander, A Nkansah, H Lu, J Liu
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019
22019
Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices
A Zehri, L Ye, J Liu
2018 7th Electronic System-Integration Technology Conference (ESTC), 01-06, 2018
22018
Fabrication and characterization of graphene based film
Y Shi, L Ye, AH Zehri, N Logothetis, P Su, N Wang, J Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 162-166, 2017
22017
Exploring Graphene Coated Copper Nanoparticles as a multifunctional Nanofiller for Micro-Scaled Copper Paste
A Zehri, TMJ Nilsson, Y Fu, J Liu
2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021
2021
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