Graphene related materials for thermal management Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... 2D Materials 7 (1), 012001, 2020 | 220 | 2020 |
Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles X Long, Z Li, X Lu, H Guo, C Chang, Q Zhang, A Zehri, W Ke, Y Yao, L Ye, ... Materials Science and Engineering: A 744, 406-414, 2019 | 55 | 2019 |
High porosity and light weight graphene foam heat sink and phase change material container for thermal management A Zehri, MK Samani, MG Latorre, A Nylander, T Nilsson, Y Fu, N Wang, ... Nanotechnology 31 (42), 424003, 2020 | 25 | 2020 |
Improved interfacial bonding strength and reliability of functionalized graphene oxide for cement reinforcement applications N Wang, S Wang, L Tang, L Ye, B Cullbrand, A Zehri, BE Tebikachew, ... Chemistry–A European Journal 26 (29), 6561-6568, 2020 | 19 | 2020 |
Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings Y Liu, C Xia, A Zehri, L Ye, N Wang, B Zhmud, H Lu, J Liu Coatings 9 (11), 754, 2019 | 18 | 2019 |
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ... Soldering & Surface Mount Technology 31 (4), 193-202, 2019 | 16 | 2019 |
Surface analysis of iron and steel nanopowder SK Manchili, R Shvab, A Zehri, L Ye, E Hryha, J Liu, L Nyborg Surface and Interface Analysis 50 (11), 1083-1088, 2018 | 11 | 2018 |
Effect of nanopowder addition on the sintering of water-atomized iron powder SK Manchili, J Wendel, A Zehri, J Liu, E Hryha, L Nyborg Metallurgical and Materials Transactions A 51, 4890-4901, 2020 | 10 | 2020 |
Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor S Chen, A Zehri, Q Wang, G Yuan, X Liu, N Wang, J Liu ChemistryOpen 8 (1), 58-63, 2019 | 10 | 2019 |
Toward ultrahigh thermal conductivity graphene films S Guo, S Chen, A Nkansah, A Zehri, M Murugesan, Y Zhang, Y Zhang, ... 2D Materials 10 (1), 014002, 2022 | 9 | 2022 |
Bin Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... Wang Q, Li M, Lu H, Sledzinska M, Torres CMSS, Volz S, Balandin AA, Xu X and …, 2020 | 9 | 2020 |
The influence of sintering process on thermal properties of nano-silver paste X Lu, W Ke, C Zhou, Y Wu, Q Zhang, S Huang, W Xia, L Ye, A Zehri, J Liu 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 8 | 2018 |
Graphene oxide and nitrogen-doped graphene coated copper nanoparticles in water-based nanofluids for thermal management in electronics A Zehri, A Nylander, TMJ Nilsson, L Ye, Y Fu, J Liu Journal of Nanofluids 11 (1), 125-134, 2022 | 6 | 2022 |
Multiple growth of graphene from a pre-dissolved carbon source A Fazi, A Nylander, A Zehri, J Sun, P Malmberg, L Ye, J Liu, Y Fu Nanotechnology 31 (34), 345601, 2020 | 6 | 2020 |
2D Materials Graphene related materials for thermal management Graphene related materials for thermal management Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... 2D Materials, 2019 | 3 | 2019 |
Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid AH Zehri, A Nylander, L Ye, J Liu 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 2 | 2019 |
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader Y Liu, N Wang, L Ye, A Zehri, A Nylander, A Nkansah, H Lu, J Liu Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019 | 2 | 2019 |
Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices A Zehri, L Ye, J Liu 2018 7th Electronic System-Integration Technology Conference (ESTC), 01-06, 2018 | 2 | 2018 |
Fabrication and characterization of graphene based film Y Shi, L Ye, AH Zehri, N Logothetis, P Su, N Wang, J Liu 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 162-166, 2017 | 2 | 2017 |
Exploring Graphene Coated Copper Nanoparticles as a multifunctional Nanofiller for Micro-Scaled Copper Paste A Zehri, TMJ Nilsson, Y Fu, J Liu 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | | 2021 |