| Study of optimal subset size in digital image correlation of speckle pattern images S Yaofeng, JHL Pang Optics and lasers in engineering 45 (9), 967-974, 2007 | 399 | 2007 |
| Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study Y Bai, K Zhou, N Srikanth, JHL Pang, X He, R Wang RSC advances 6 (42), 35731-35739, 2016 | 267 | 2016 |
| Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo Thin solid films 462, 370-375, 2004 | 266 | 2004 |
| A review of recent works on inclusions K Zhou, HJ Hoh, X Wang, LM Keer, JHL Pang, B Song, QJ Wang Mechanics of Materials 60, 144-158, 2013 | 258 | 2013 |
| Finite element formulation for a digital image correlation method Y Sun, JHL Pang, CK Wong, F Su Applied optics 44 (34), 7357-7363, 2005 | 257 | 2005 |
| Testing adhesive joints: best practices LFM Da Silva, DA Dillard, B Blackman, RD Adams John Wiley & Sons, 2012 | 253 | 2012 |
| Drop impact reliability testing for lead-free and lead-based soldered IC packages DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low Microelectronics reliability 46 (7), 1160-1171, 2006 | 219 | 2006 |
| Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy XQ Shi, W Zhou, HLJ Pang, ZP Wang | 214 | 1999 |
| Thermal cycling analysis of flip-chip solder joint reliability JHL Pang, DYR Chong, TH Low IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001 | 211 | 2001 |
| Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy XQ Shi, HLJ Pang, W Zhou, ZP Wang International Journal of fatigue 22 (3), 217-228, 2000 | 210 | 2000 |
| Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging HLJ Pang, KH Tan, XQ Shi, ZP Wang Materials Science and Engineering: A 307 (1-2), 42-50, 2001 | 193 | 2001 |
| Thermo-mechanical model for simulating laser cladding induced residual stresses with single and multiple clad beads Y Chew, JHL Pang, G Bi, B Song Journal of Materials Processing Technology 224, 89-101, 2015 | 149 | 2015 |
| Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder JHL Pang, BS Xiong, TH Low 2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004 | 148 | 2004 |
| Electromigration induced ductile-to-brittle transition in lead-free solder joints F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang Applied physics letters 89 (14), 2006 | 146 | 2006 |
| Low cycle fatigue models for lead-free solders JHL Pang, BS Xiong, TH Low Thin solid films 462, 408-412, 2004 | 145 | 2004 |
| Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh Journal of Electronic Materials 33, 1219-1226, 2004 | 143 | 2004 |
| Vibration reliability test and finite element analysis for flip chip solder joints FX Che, JHL Pang Microelectronics reliability 49 (7), 754-760, 2009 | 136 | 2009 |
| Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches L Zhu, W Marcinkiewicz IEEE Transactions on Components and Packaging Technologies 28 (3), 449-456, 2005 | 134 | 2005 |
| Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability L Xu, JHL Pang, F Che Journal of Electronic Materials 37, 880-886, 2008 | 126 | 2008 |
| Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging L Xu, JHL Pang Thin solid films 504 (1-2), 362-366, 2006 | 124 | 2006 |
Luhua XuApple Inc在 apple.com 的电子邮件经过验证
