| Microstructure, mechanical properties, and deformation behavior of Sn–1.0 Ag–0.5 Cu solder after Ni and Sb additions AA El-Daly, AE Hammad, A Fawzy, DA Nasrallh Materials & design 43, 40-49, 2013 | 169 | 2013 |
| Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions AA El-Daly, AE Hammad Materials & Design 40, 292-298, 2012 | 134 | 2012 |
| Creep properties of Sn–Sb based lead-free solder alloys AA El-Daly, Y Swilem, AE Hammad Journal of Alloys and Compounds 471 (1-2), 98-104, 2009 | 132 | 2009 |
| Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5 Ag–0.7 Cu low-Ag solder alloys for electronic applications AE Hammad Materials & Design (1980-2015) 52, 663-670, 2013 | 104 | 2013 |
| Development of high strength Sn–0.7 Cu solders with the addition of small amount of Ag and In AA El-Daly, AE Hammad Journal of Alloys and Compounds 509 (34), 8554-8560, 2011 | 103 | 2011 |
| Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys AA El-Daly, AE Hammad Journal of Alloys and Compounds 505 (2), 793-800, 2010 | 82 | 2010 |
| Enhancing mechanical response of hypoeutectic Sn–6.5 Zn solder alloy using Ni and Sb additions AA El-Daly, AE Hammad, GA Al-Ganainy, AA Ibrahiem Materials & Design (1980-2015) 52, 966-973, 2013 | 79 | 2013 |
| Investigation of microstructure and mechanical properties of novel Sn–0.5 Ag–0.7 Cu solders containing small amount of Ni AE Hammad Materials & Design 50, 108-116, 2013 | 77 | 2013 |
| Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders AA El-Daly, AE Hammad, GS Al-Ganainy, M Ragab Materials Science and Engineering: A 608, 130-138, 2014 | 75 | 2014 |
| Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5 Zn alloy AA El-Daly, AE Hammad, GS Al-Ganainy, AA Ibrahiem Materials & Design (1980-2015) 56, 594-603, 2014 | 67 | 2014 |
| Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders AA El-Daly, AE Hammad Materials Science and Engineering: A 527 (20), 5212-5219, 2010 | 66 | 2010 |
| Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In AA El-Daly, F El-Tantawy, AE Hammad, MS Gaafar, EH El-Mossalamy, ... Journal of Alloys and Compounds 509 (26), 7238-7246, 2011 | 59 | 2011 |
| Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn AA El-Daly, AE Hammad, GS Al-Ganainy, M Ragab Journal of alloys and compounds 614, 20-28, 2014 | 52 | 2014 |
| Enhancing the ductility and mechanical behavior of Sn-1.0 Ag-0.5 Cu lead-free solder by adding trace amount of elements Ni and Sb AE Hammad Microelectronics Reliability 87, 133-141, 2018 | 39 | 2018 |
| Influences of Ag and Au additions on structure and tensile strength of Sn-5Sb lead free solder alloy AA El-Daly, Y Swilem, AE Hammad Journal of materials science & technology 24 (6), 921, 2008 | 34 | 2008 |
| Enhancing the microstructure and tensile creep resistance of Sn-3.0 Ag-0.5 Cu solder alloy by reinforcing nano-sized ZnO particles AE Hammad, AA Ibrahiem Microelectronics Reliability 75, 187-194, 2017 | 32 | 2017 |
| Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method AA El-Daly, AA Ibrahiem, AE Hammad Journal of Alloys and Compounds 767, 464-473, 2018 | 17 | 2018 |
| Achieving microstructure refinement and superior mechanical performance of Sn-2.0 Ag-0.5 Cu-2.0 Zn (SACZ) solder alloy with rotary magnetic field AE Hammad, M Ragab Microelectronics Reliability 113, 113932, 2020 | 14 | 2020 |
| Mechanical deformation behavior of Sn-Ag-Cu solders with minor addition of 0.05 wt.% Ni AE Hammad, AM El-Taher Journal of electronic materials 43, 4146-4157, 2014 | 14 | 2014 |
| Enhancement of fluorescence and photostability based on interaction of fluorescent dyes with silver nanoparticles for luminescent solar concentrators S El-Molla, AF Mansour, AE Hammad Journal of Nanomaterials 2017 (1), 9701251, 2017 | 9 | 2017 |
