| Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner Y Ding, Y Yan, Q Chen, S Wang, R Su, H Dang Microelectronics Reliability 54 (6-7), 1384-1391, 2014 | 36 | 2014 |
| Electrical characterization of coaxial silicon–insulator–silicon through-silicon vias: Theoretical analysis and experiments Z Chen, M Xiong, B Li, Y Yan, Y Ding IEEE Transactions on Electron Devices 63 (12), 4880-4887, 2016 | 25 | 2016 |
| Wideband capacitance evaluation of silicon–insulator–silicon through-silicon-vias for 3D integration applications X Wang, M Xiong, Z Chen, B Li, Y Yan, Y Ding IEEE Electron Device Letters 37 (2), 216-219, 2015 | 21 | 2015 |
| Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs) Y Ding, M Xiong, Y Yan, S Wang, Q Chen, W Wang, Z Chen Microelectronic Engineering 149, 78-84, 2016 | 16 | 2016 |
| Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via (TSV) application YT Ding, YY Yan, QW Chen, SW Wang, X Chen, YY Chen Science China Technological Sciences 57, 1616-1625, 2014 | 16 | 2014 |
| Elimination of scallop-induced stress fluctuation on through-silicon-vias (TSVs) by employing polyimide liner C Xue, Z Cheng, Z Chen, Y Yan, Z Cai, Y Ding IEEE transactions on device and materials reliability 18 (2), 266-272, 2018 | 14 | 2018 |
| Study of vacuum-assisted spin coating of polymer liner for high-aspect-ratio through-silicon-via applications Y Yan, Y Ding, T Fukushima, KW Lee, M Koyanagi IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (4 …, 2016 | 14 | 2016 |
| Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5 D/3D … QW Chen, YY Yan, YT Ding, SW Wang, WJ Wang Microsystem Technologies 21, 2207-2214, 2015 | 14 | 2015 |
| Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners YY Yan, M Xiong, B Liu, YT Ding, ZM Chen Science China Technological Sciences 59, 1581-1590, 2016 | 11 | 2016 |
| Modeling and characterization of annealing-induced Cu protrusion of TSVs with polyimide liner considering diffusion creep behavior B Yang, Y Ding, Z Cheng, A Ren, L Xiao, Y Yan, Z Zhang, Z Chen IEEE Transactions on Electron Devices 70 (2), 695-701, 2022 | 9 | 2022 |
| A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams H Yang, A Ren, Y Ding, L Xiao, T Pan, Y Yan, W Jiao, H Xie Microsystems & Nanoengineering 9 (1), 108, 2023 | 8 | 2023 |
| Ultra-deep annular Cu through-silicon-vias fabricated using single-sided process L Xiao, Y Ding, Y Su, Z Zhang, Y Yan, Z Chen, H Xie IEEE Electron Device Letters 43 (3), 426-429, 2022 | 8 | 2022 |
| Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications Y Yan, Y Ding, Q Chen, K Lee, T Fukushima, M Koyanagi 2015 International 3D Systems Integration Conference (3DIC), TS5. 2.1-TS5. 2.5, 2015 | 8 | 2015 |
| Electrical characteristics and thermal reliability of blind through-silicon-vias with polyimide liners B Liu, Y Yan, Z Zhang, Z Chen, Y Ding 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 7 | 2016 |
| Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias Y Yan, Z Zhang, Z Cheng, L Zhou, Z Chen, Y Ding 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2016 | 6 | 2016 |
| Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs W Wang, Y Yan, Y Ding, S Wang, W Wang, Y Sun, Q Chen Microelectronic Engineering 137, 146-152, 2015 | 6 | 2015 |
| Highly conformal polyimide liner deposition in high‐aspect‐ratio through silicon vias Y Ding, Y Yan, M Xiong, S Wang, Q Chen, Z Chen Micro & Nano Letters 11 (5), 253-255, 2016 | 5 | 2016 |
| A polymer trench filling based silicon isolation technique and its application to two-axis scanning comb-drive micromirrors Y Cao, Y Ding, Y Yan, Q Qi, Y Jia, Y Wu, H Xie Sensors and Actuators A: Physical 370, 115256, 2024 | 3 | 2024 |
| Thermal Compression Bonding Process Development for C2W Stacking in 3D Package P Sun, Y Yan, CAO Liqiang 2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020 | 3 | 2020 |
| Multi-chip Stacking with Fine Pitch μbumps and TSVs for Heterogeneous Integration Y Yan, G Wang, H Su, F Dai, P Sun, L Cao 2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020 | 2 | 2020 |
