关注
Anil Kunwar
标题
引用次数
引用次数
年份
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
H Ma, A Kunwar, J Sun, B Guo, H Ma
Scripta Materialia 107, 88-91, 2015
462015
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song
Journal of Materials Science & Technology 50, 115-127, 2020
422020
Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity
S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124, 1-8, 2018
402018
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma
Materials research bulletin 99, 239-248, 2018
402018
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints
A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
402018
In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process
L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao
Applied surface science 305, 133-138, 2014
392014
Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface
A Kunwar, J Hektor, S Nomoto, YA Coutinho, N Moelans
International Journal of Mechanical Sciences 184, 105843, 2020
362020
3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives
HB Mamo, M Adamiak, A Kunwar
Journal of the mechanical behavior of biomedical materials 143, 105930, 2023
342023
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
A Kunwar, YA Coutinho, J Hektor, H Ma, N Moelans
Journal of Materials Science & Technology 59, 203-219, 2020
302020
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang
Materials Letters 172, 211-215, 2016
302016
Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step …
MM Hussain, H Ma, M Huang, Z Gao, J Cao, C Wang, C Dong, Y Wang, ...
Surface and Coatings Technology 398, 125970, 2020
282020
Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows
HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
262018
A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder
HT Ma, J Wang, L Qu, N Zhao, A Kunwar
Journal of electronic materials 42, 2686-2695, 2013
262013
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
222018
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows
H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma
Intermetallics 90, 90-96, 2017
222017
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
182019
Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage
B Guo, A Kunwar, C Jiang, N Zhao, J Sun, J Chen, Y Wang, M Huang, ...
Journal of Materials Science: Materials in Electronics 29, 589-601, 2018
182018
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
A Kunwar, H Ma, H Ma, B Guo, Z Meng, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 27, 7699-7706, 2016
182016
Size effect on interface reaction of Sn–xCu/Cu solder joints during multiple reflows
R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma
Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019
162019
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling …
B Guo, H Ma, C Jiang, Y Wang, A Kunwar, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 28, 5398-5406, 2017
152017
系统目前无法执行此操作,请稍后再试。
文章 1–20