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Dae Hyun Kim
Dae Hyun Kim
在 eecs.wsu.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
A study of through-silicon-via impact on the 3D stacked IC layout
DH Kim, K Athikulwongse, SK Lim
Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009
3392009
3D-MAPS: 3D Massively parallel processor with stacked memory
DH Kim, K Athikulwongse, M Healy, M Hossain, M Jung, I Khorosh, ...
IEEE International Solid-State Circuits Conference, 188-190, 2012
2242012
Architectural support for mitigating row hammering in DRAM memories
DH Kim, PJ Nair, MK Qureshi
IEEE Computer Architecture Letters 14 (1), 9-12, 2014
1802014
Fast and accurate analytical modeling of through-silicon-via capacitive coupling
DH Kim, S Mukhopadhyay, SK Lim
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
1012011
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory
MB Healy, K Athikulwongse, R Goel, MM Hossain, DH Kim, YJ Lee, ...
IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010
1002010
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
DH Kim, S Mukhopadhyay, SK Lim
Proceedings of the 11th international workshop on System level interconnect …, 2009
882009
Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory)
DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ...
IEEE Transactions on Computers 64 (1), 112-125, 2013
822013
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system
M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 694-697, 2010
782010
TSV-aware interconnect length and power prediction for 3D stacked ICs
DH Kim, S Mukhopadhyay, SK Lim
2009 IEEE International Interconnect Technology Conference, 26-28, 2009
752009
Pre-bond and post-bond test and signal recovery structure to characterize and repair TSV defect induced signal degradation in 3-D system
M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
732011
Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs
DH Kim, SK Lim
Proceedings of the 12th ACM/IEEE international workshop on System level …, 2010
722010
Optimizing 3D NoC design for energy efficiency: A machine learning approach
S Das, JR Doppa, DH Kim, PP Pande, K Chakrabarty
2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 705-712, 2015
702015
Block-level 3D IC design with through-silicon-via planning
DH Kim, RO Topaloglu, SK Lim
17th Asia and South Pacific Design Automation Conference, 335-340, 2012
422012
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs
T Song, C Liu, DH Kim, SK Lim, J Cho, J Kim, JS Pak, S Ahn, J Kim, ...
2011 12th International Symposium on Quality Electronic Design, 1-7, 2011
382011
TSV-aware interconnect distribution models for prediction of delay and power consumption of 3-D stacked ICs
DH Kim, S Mukhopadhyay, SK Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014
372014
Physical experiments on the hydrodynamic response of submerged floating tunnel against the wave action
오상호, 박우선, 장세철, 김동현, 안희도
7th International Conference on Asian and Pacific Coasts, APAC 2013, 582-587, 2013
372013
A 7 Gb/s/pin 1 Gbit GDDR5 SDRAM with 2.5 ns bank to bank active time and no bank group restriction
TY Oh, YS Sohn, SJ Bae, MS Park, JH Lim, YK Cho, DH Kim, DM Kim, ...
IEEE journal of solid-state circuits 46 (1), 107-118, 2010
302010
Backend low-k TDDB chip reliability simulator
M Bashir, DH Kim, K Athikulwongse, SK Lim, L Milor
2011 International Reliability Physics Symposium, 2C. 2.1-2C. 2.10, 2011
292011
Design quality trade-off studies for 3-D ICs built with sub-micron TSVs and future devices
DH Kim, SK Lim
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 2 (2 …, 2012
282012
Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs
DH Kim, S Kim, SK Lim
International Workshop on System Level Interconnect Prediction, 1-8, 2011
282011
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