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ERIC C LIU
ERIC C LIU
State University of New York Polytechnics Institute
在 sunypoly.edu 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Autonomous real-time ground ubiquitous surveillance-imaging system (ARGUS-IS)
B Leininger, J Edwards, J Antoniades, D Chester, D Haas, E Liu, ...
Defense Transformation and Net-Centric Systems 2008 6981, 141-151, 2008
902008
Fin profile structure and method of making same
CW Chang, CF Liu, C Peng, TC Huang, RCJ Chen
US Patent 8,546,891, 2013
462013
FinFET device structure and methods of making same
YC Lin, CH Wu, ECF Liu, RCJ Chen, CC Chen
US Patent 8,900,937, 2014
252014
Method for processing photoresist materials and structures
N Mohanty, ECF Liu, E Franke
US Patent 10,049,892, 2018
21*2018
Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges
A Raley, L Huli, S Grzeskowiak, K Lutker-Lee, A Krawicz, Y Feurprier, ...
Advanced Etch Technology and Process Integration for Nanopatterning XI 12056 …, 2022
202022
Process of manufacturing Fin-FET device
CW Chang, A Chang, ECF Liu, RCJ Chen, LIN Chia-Tai, C Peng
US Patent 9,704,974, 2017
192017
Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme
N Mohanty, E Franke, E Liu, A Raley, J Smith, R Farrell, M Wang, K Ito, ...
Advanced Etch Technology for Nanopatterning IV 9428, 67-80, 2015
192015
Defect detection strategies and process partitioning for SE EUV patterning
L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ...
Extreme Ultraviolet (EUV) Lithography IX 10583, 87-103, 2018
172018
Simultaneous formation of source/drain openings with different profiles
ECF Liu, S Thitinun, WU Dai-Lin, RCJ Chen, CC Chen
US Patent 9,263,551, 2016
162016
FinFETs with regrown source/drain and methods for forming the same
ECF Liu, TW Kao, RCJ Chen, CC Chen
US Patent 9,034,706, 2015
162015
Dispense system of a photoresist coating machine
MC Yang, KF Huang, E Liu, ET Tan
US Patent 6,062,442, 2000
132000
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
A Dutta, J Church, J Lee, B O’Brien, L Meli, CC Liu, S Sharma, K Petrillo, ...
Extreme Ultraviolet (EUV) Lithography XI 11323, 213-224, 2020
122020
Defect detection strategies and process partitioning for single-expose EUV patterning
L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 18 (1), 011006-011006, 2019
122019
Photoresist solution storage and supply device
E Liu
US Patent 5,871,028, 1999
121999
A 32Gb/s NRZ 37dB SerDes in 10nm CMOS to support PCI express gen 5 protocol
M Bichan, C Ting, B Zand, J Wang, R Shulyzki, J Guthrie, K Tyshchenko, ...
2020 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2020
112020
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
R Clark, ECF Liu, A Raley, H Tuitje, K Siefering
US Patent App. 16/356,345, 2020
102020
Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch
A Raley, C Mack, S Thibaut, E Liu, A Ko
International Conference on Extreme Ultraviolet Lithography 2018 10809, 183-201, 2018
102018
Characterization of Surface Variation of Chemically Amplified Photoresist to Evaluate Extreme Ultraviolet Lithography Stochastics Effects
E Liu, A Hegazy, H Choi, M Weires, R Brainard, G Denbeaux
Journal of photopolymer science and technology 34 (1), 63-70, 2021
92021
Ruthenium metal feature fill for interconnects
KH Yu, N Joy, ECF Liu, DL O'meara, D Rosenthal, M Igeta, C Wajda, ...
US Patent 10,700,009, 2020
72020
Fin profile structure and method of making same
CW Chang, CF Liu, C Peng, TC Huang, RCJ Chen
US Patent 8,658,539, 2014
72014
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