| An overview of the development of a GPU with integrated HBM on silicon interposer CC Lee, CP Hung, C Cheung, PF Yang, CL Kao, DL Chen, MK Shih, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1439-1444, 2016 | 160 | 2016 |
| Antimutagenicity of ethanol extracts of bee glue against environmental mutagens SN Jeng, MK Shih, CM Kao, TZ Liu, SC Chen Food and chemical toxicology 38 (10), 893-897, 2000 | 57 | 2000 |
| Fan-out chip on substrate device interconnection reliability analysis YC Lee, WH Lai, I Hu, MK Shih, CL Kao, D Tarng, CP Hung 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 22-27, 2017 | 37 | 2017 |
| Semiconductor package with integrated metal pillars and manufacturing methods thereof MK Shih, CC Lee US Patent 8,698,307, 2014 | 34 | 2014 |
| Electrical, thermal, and mechanical characterization of eWLB, fully molded fan-out package, and fan-out chip last package M Shih, CY Huang, TH Chen, CC Wang, D Tarng, CP Hung IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 30 | 2019 |
| Experimental method and FE simulation model for evaluation of wafer probing parameters DS Liu, MK Shih Microelectronics journal 37 (9), 871-883, 2006 | 27 | 2006 |
| FE simulation model for warpage evaluation of glass interposer substrate packages M Shih, K Chen, T Lee, D Tarng, CP Hung IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 21 | 2021 |
| Characterization of dual side molding SiP module JY Lai, TY Chen, MH Wang, MK Shih, D Tarng, CP Hung 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1039-1044, 2017 | 21 | 2017 |
| Thermal and mechanical characterization of 2.5-D and fan-out chip on substrate chip-first and chip-last packages MK Shih, W Lai, T Liao, K Chen, DL Chen, CP Hung IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 20 | 2022 |
| In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays AT Wu, CY Tsai, CL Kao, MK Shih, YS Lai, HY Lee, CS Ku Journal of electronic materials 38, 2308-2313, 2009 | 17 | 2009 |
| Measurement and analysis of contact resistance in wafer probe testing DS Liu, MK Shih, WH Huang Microelectronics Reliability 47 (7), 1086-1094, 2007 | 16 | 2007 |
| A mechanics model for the moisture induced delamination in fan-out wafer-level package TC Chiu, JY Wu, WT Liu, CW Liu, DL Chen, MK Shih, D Tarng 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1205-1211, 2020 | 15 | 2020 |
| Warpage characterization of glass interposer package development MK Shih, C Hsu, Y Chang, K Chen, I Hu, T Lee, D Tarng, CP Hung 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1392-1397, 2017 | 13 | 2017 |
| Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages YS Lai, MK Shih, CC Lee, TH Wang Microelectronics Reliability 52 (11), 2851-2855, 2012 | 12 | 2012 |
| Next-generation high-density PCB development by fan-out RDL technology MK Shih, YW Huang, GS Lin IEEE Transactions on Device and Materials Reliability 22 (2), 296-305, 2022 | 11 | 2022 |
| Evaluation of three-point bending strength of thin silicon die with a consideration of geometric nonlinearity MY Tsai, PS Huang, JH Yeh, HY Liu, YC Chao, F Tsai, DL Chen, MK Shih, ... IEEE Transactions on Device and Materials Reliability 19 (4), 615-621, 2019 | 11 | 2019 |
| Solder joint reliability analysis for large size WLCSP MK Shih, HC Shih, YC Lee, D Tamg, CP Hung 2017 International Conference on Electronics Packaging (ICEP), 61-65, 2017 | 11 | 2017 |
| Development of probing mark analysis model [IC testing] YC Chao, YJ Lee, J Liu, GS Shen, FJ Tsai, DS Liu, MK Shih Fifth International Conference onElectronic Packaging Technology Proceedings …, 2003 | 10 | 2003 |
| Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging MK Shih, S Shih, TW Liao, DL Chen, DS Liu, D Tarng Microelectronics Reliability 130, 114488, 2022 | 9 | 2022 |
| Deformation prediction of 2.5 D IC package I Hu, MH Wang, KY Chen, YC Lee, M Shih 2016 11th International Microsystems, Packaging, Assembly and Circuits …, 2016 | 9 | 2016 |
