| Fabrication of relaxed InGaN pseudo-substrates composed of micron-sized pattern arrays with high fill factors using porous GaN SS Pasayat, C Gupta, D Acker-James, DA Cohen, SP DenBaars, ... Semiconductor Science and Technology 34 (11), 115020, 2019 | 48 | 2019 |
| First demonstration of improvement in hole conductivity in c-plane III-Nitrides through application of uniaxial strain C Gupta, Y Tsukada, B Romanczyk, SS Pasayat, DA James, E Ahmadi, ... Japanese Journal of Applied Physics 58 (3), 030908, 2019 | 18 | 2019 |
| 15 millinewton force, 1 millimeter displacement, low-power MEMS gripper CB Schindler, HC Gomez, D Acker-James, D Teal, W Li, KSJ Pister 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems …, 2020 | 17 | 2020 |
| Ultra-high silicon doped N-polar GaN contact layers grown by metal-organic chemical vapor deposition N Hatui, A Krishna, H Li, C Gupta, B Romanczyk, D Acker-James, ... Semiconductor Science and Technology 35 (9), 095002, 2020 | 16 | 2020 |
| Single-chip micro-mote for microrobotic platforms A Moreno, F Maksimovic, L Lee, B Kilberg, C Schindler, H Gomez, D Teal, ... Government Microcircuit Applications & Critical Technology Conference. GOMACTech, 2020 | 8 | 2020 |
| PCB-less Integration of a Robust Wireless MEMS Tactile Package D Acker-James | | 2023 |
