| Determining interface dielectric losses in superconducting coplanar-waveguide resonators W Woods, G Calusine, A Melville, A Sevi, E Golden, DK Kim, ... Physical Review Applied 12 (1), 014012, 2019 | 128 | 2019 |
| Solid-state qubits integrated with superconducting through-silicon vias DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ... npj Quantum Information 6 (1), 59, 2020 | 108 | 2020 |
| Advanced fabrication processes for superconductor electronics: Current status and new developments SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ... IEEE Transactions on Applied Superconductivity 29 (5), 1-13, 2019 | 103 | 2019 |
| Comparison of dielectric loss in titanium nitride and aluminum superconducting resonators A Melville, G Calusine, W Woods, K Serniak, E Golden, BM Niedzielski, ... Applied Physics Letters 117 (12), 2020 | 59 | 2020 |
| Josephson arbitrary waveform synthesis with multilevel pulse biasing JA Brevik, NE Flowers-Jacobs, AE Fox, EB Golden, PD Dresselhaus, ... IEEE Transactions on Applied Superconductivity 27 (3), 1-7, 2017 | 39 | 2017 |
| Inductance of superconductor integrated circuit features with sizes down to 120 nm SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky Superconductor Science and Technology 34 (8), 085005, 2021 | 36 | 2021 |
| Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ... IEEE Transactions on Applied Superconductivity 29 (5), 1-8, 2019 | 29 | 2019 |
| Fabrication of superconducting through-silicon vias JL Mallek, DRW Yost, D Rosenberg, JL Yoder, G Calusine, M Cook, ... arXiv preprint arXiv:2103.08536, 2021 | 23 | 2021 |
| A new family of bioSFQ logic/memory cells VK Semenov, EB Golden, SK Tolpygo IEEE Transactions on Applied Superconductivity 32 (4), 1-5, 2021 | 21 | 2021 |
| Progress toward superconductor electronics fabrication process with planarized NbN and NbN/Nb layers SK Tolpygo, JL Mallek, V Bolkhovsky, R Rastogi, EB Golden, TJ Weir, ... IEEE Transactions on Applied Superconductivity 33 (5), 1-12, 2023 | 18 | 2023 |
| Mutual and self-inductance in planarized multilayered superconductor integrated circuits: Microstrips, striplines, bends, meanders, ground plane perforations SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky IEEE Transactions on Applied Superconductivity 32 (5), 1-31, 2022 | 13 | 2022 |
| A 150-nm process node of an eight-Nb-layer fully planarized process for superconductor electronics SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, E Golden, TJ Weir, ... Proceedings of the Applied Superconductivity Conference, ASC 2020 Virtual …, 2020 | 12 | 2020 |
| Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf. 6 DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ... | 12 | 2020 |
| SFQ bias for SFQ digital circuits VK Semenov, EB Golden, SK Tolpygo IEEE Transactions on Applied Superconductivity 31 (5), 1-7, 2021 | 10 | 2021 |
| BioSFQ circuit family for neuromorphic computing: Bridging digital and analog domains of superconductor technologies VK Semenov, EB Golden, SK Tolpygo IEEE Transactions on Applied Superconductivity 33 (5), 1-8, 2023 | 8 | 2023 |
| A 150-nm node of an eight-Nb-layer fully planarized process for superconductor electronics SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, E Golden, TJ Weir, ... presented at the Applied Superconductivity Conference, Wk1EOr3B-01, 2020 | 7 | 2020 |
| Self-and mutual inductance of NbN and bilayer NbN/Nb inductors in a planarized fabrication process with Nb ground planes SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky, R Rastogi IEEE Transactions on Applied Superconductivity 33 (5), 1-11, 2023 | 6 | 2023 |
| Fabrication of superconducting through-silicon vias. 2021 JL Mallek, DRW Yost, D Rosenberg, JL Yoder, G Calusine, M Cook, ... arXiv preprint arXiv:2103.08536, 0 | 6 | |
| On-chip temperature distribution of Josephson voltage standard devices AE Fox, EB Golden, PD Dresselhaus, SP Benz IEEE Transactions on Applied Superconductivity 27 (4), 1-5, 2016 | 5 | 2016 |
| Inductance and mutual inductance of superconductor integrated circuit features with sizes down to 120 nm. part I S Tolpygo, EB Golden, TJ Weir, V Bolkhovsky arXiv preprint arXiv:2101.07457, 2021 | 4 | 2021 |
